Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
DIOTEC BC547CBK
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- DIOTEC BC547CBK
- Type
- DIOTEC
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- DIOTEC
- Electronic Component
- BC547CBK
- Electronic Component
- 1
- Package
- TO-92
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.214g
- Electronic Component
- 1
- Electronic Component
- BM0226506821
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC547CBK 产品概述
一、概述
BC547CBK 是一款通用型 NPN 双极结晶体管，适用于小信号放大和低功率开关场合。由 DIOTEC（德欧泰克）提供的该型号在 TO-92 封装下具有可靠的电气特性，兼顾高电流增益与较高的截止电压，适用于音频前级、传感器放大和逻辑接口等电路。
二、主要电气参数
- 直流电流增益 (hFE)：420（典型，Ic=2mA，Vce=5V，C 增益组 C）
- 最大集电极电流 (Ic)：100mA
- 集电极-射极击穿电压 (Vceo)：45V
- 集电极截止电流 (Icbo)：15nA（典型）
- 射基极击穿电压 (Vebo)：5V
- 特征频率 (fT)：约 300MHz（小信号高频性能良好）
- 饱和电压 VCE(sat)：约 600mV（典型，具体取决于驱动电流）
- 耗散功率 (Pd)：500mW（TO-92 封装，注意散热与环境温度限制）
- 工作结温范围 (Tj)：-55°C ~ +150°C
三、封装与引脚
BC547CBK 常见为 TO-92 塑封三引脚封装。常见引脚排列（面向平坦面，左→右）为 C‑B‑E，但不同厂家封装顺序可能存在差异，实际使用前请以厂商数据手册或实物标识为准。
四、典型应用
- 小信号放大器（音频前级、射频前置放大在适当偏置下）
- 低电流开关与驱动（继电器小电流驱动、指示灯驱动）
- 信号整形与接口缓冲（传感器接口、逻辑电平转换）
- 教学与原型电路，替代常见的通用 NPN 管
五、使用建议与注意事项
- 虽然 hFE 在低电流点极高，但增益随温度与电流显著变化，设计时应考虑最坏情况（使用较低增益或配合反馈稳定）。
- 不要超过 Ic=100mA 与 Vceo=45V 的额定值；长时间靠近耗散功率上限会导致结温升高，影响可靠性。TO-92 的 Pd 为 500mW，实际允许功耗受环境温度和印制板散热影响较大。
- Vebo 仅 5V，基极对射极施加反向电压时应避免超出该值以防击穿。
- 在高频或射频应用中，需关注寄生电容与布线引起的性能下降。
六、总结
BC547CBK（DIOTEC）是一款性能均衡的高增益 NPN 小信号晶体管，适合多种低功耗放大与开关场合。选型时兼顾 hFE、最大电流与功耗限制，并参考厂家完整数据手册进行电气与热设计，可在通用电子与工业控制等领域发挥良好性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
