WMSIC Electronic Components

EVERLIGHT IR91-21C/TR10 IR91

ModelIR91-21C/TR10
PackageSMD,2.5x2mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT IR91-21C / TR10
Type
EVERLIGHT
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
IR91-21C/TR10
Electronic Component
1
Package
SMD,2.5x2mm
Electronic Component
940nm
Electronic Component
Infrared Emitter
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0225768277
Operating Temperature
25℃~+85℃
Current
65mA
Electronic Component
3mW/sr@IF=20mA
(Vf)
1.5V
Power Dissipation(Pd)
130mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IR91-21C/TR10 红外发射管产品概述

概要

IR91-21C/TR10 是由台湾亿光电子股份有限公司(Everlight Electronics Co Ltd)制造的红外发射管,属于表面贴装型(SMD)元器件。该产品广泛应用于各种需要红外光源的电子设备中,包括遥控器、传感器、光电通信系统等。

基础参数

  • 制造商: Everlight Electronics Co Ltd
  • 包装: 卷带(TR)
  • 零件状态: 有源
  • 类型: 红外(IR)
  • 电流 - DC 正向 (If)(最大值): 65mA
  • 不同 If 时最小辐射强度 (Ie): 3mW/sr @ 20mA
  • 波长: 940nm
  • 电压 - 正向 (Vf)(典型值): 1.2V
  • 视角: 25°
  • 方向: 顶视图
  • 工作温度: -25°C ~ 85°C(TA)
  • 安装类型: 表面贴装型
  • 封装/外壳: 2-SMD,Z形弯曲

描述

IR91-21C/TR10 采用2x2.5mm的小型SMD封装,适合于空间有限但需要高性能红外光源的应用场景。以下是其详细特性和应用场景:

电气特性

  • 最大正向电流 (If): 65mA,确保在正常工作条件下不会因过载而损坏。
  • 典型正向电压 (Vf): 1.2V,低功耗设计有利于节能和延长使用寿命。
  • 最小辐射强度 (Ie): 在20mA电流下达到3mW/sr,提供稳定且足够的红外辐射强度。

光学特性

  • 波长: 940nm,这是常见的红外波长,适用于大多数红外应用。
  • 视角: 25°,提供集中且方向性的红外光束,提高信号传输的准确性和距离。

机械特性

  • 封装类型: 2-SMD,Z形弯曲设计方便在PCB上进行表面贴装。
  • 尺寸: 2x2.5mm的小型封装,使其在紧凑的电子设备中也能找到应用空间。

工作环境

  • 工作温度范围: -25°C ~ 85°C(TA),能够在广泛的温度范围内稳定工作,适用于各种环境条件下的应用。

应用场景

IR91-21C/TR10 广泛应用于以下领域:

  1. 遥控器系统:作为遥控器发射端的关键组件,提供可靠的红外信号传输。
  2. 传感器系统:用于光电传感、距离测量、运动检测等场景。
  3. 光电通信系统:在短距离光电通信中作为发送端设备。
  4. 安全系统:用于入侵检测、门禁控制等安全设备中。
  5. 工业自动化:在机器人视觉、物料传送等工业自动化应用中发挥重要作用。

优势

  • 高效能: 低功耗设计与高辐射强度的结合,确保在各种应用中提供高效能。
  • 小型化: 2x2.5mm的小型SMD封装,使其适合于现代电子设备的紧凑设计要求。
  • 广泛适用性: 支持广泛的工作温度范围和多种应用场景,使其成为开发者和工程师的首选元器件之一。

使用注意事项

  • 在使用IR91-21C/TR10时,应确保电流不超过最大值(65mA)以避免过热或损坏。
  • 请参考数据手册中的具体安装和焊接指南,以确保最佳的性能和可靠性。
  • 在设计时考虑到视角和辐射强度,以确保红外信号能够准确地传输到目标位置。

总之,IR91-21C/TR10 是一款性能优异、适用性广泛的红外发射管,能够满足各种需要高质量红外光源的电子设备需求。其小型化设计、低功耗特性以及广泛的工作温度范围,使其成为现代电子产品开发中的重要组成部分。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.