WMSIC Electronic Components

EVERLIGHT HIR42-21C/L289/TR8 HIR42

ModelHIR42-21C/L289/TR8
PackageSMD,2.2x1.8mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT HIR42-21C / L289 / TR8
Type
SMD, 2.2X1.8MM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
HIR42-21C/L289/TR8
Electronic Component
1
Package
SMD,2.2x1.8mm
Electronic Component
850nm
Electronic Component
Infrared Emitter
Electronic Component
0.102g
Electronic Component
1
Electronic Component
BM0227655363
Operating Temperature
25℃~+85℃
Current
65mA
Electronic Component
11mW/sr@IF=20mA
(Vf)
1.4V
Power Dissipation(Pd)
130mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EVERLIGHT HIR42-21C/L289/TR8 红外发射管产品概述

一、产品简介

HIR42-21C/L289/TR8 是台湾亿光(EVERLIGHT)推出的一款小尺寸表面贴装红外发射二极管,封装尺寸仅 2.2 × 1.8 mm,中心波长 850 nm,适用于各种近距离红外发射与检测应用。该器件在 20 mA 驱动条件下具有较高的辐射强度,兼顾小体积与良好的光输出效率,适合对体积、成本和可靠性有要求的消费类与工业类产品。

二、主要参数

  • 波长:850 nm
  • 正向压降 Vf(典型):1.4 V
  • 辐射强度(典型):11 mW/sr @ 20 mA
  • 额定正向电流 If(最大):65 mA
  • 直流反向耐压 Vr(最大):5 V
  • 耗散功率 Pd:130 mW
  • 工作温度范围:-25 ℃ ~ +85 ℃
  • 封装形式:SMD,2.2 × 1.8 mm
  • 品牌:EVERLIGHT(亿光)

三、主要特点

  • 小尺寸 SMD 封装,适合高密度贴片组装及自动化生产。
  • 在 20 mA 条件下提供 11 mW/sr 的较高辐射强度,发射效率高。
  • 低正向压降(约 1.4 V),降低驱动功耗与电路复杂度。
  • 容许较宽的工作温度范围,适应一般消费与工业温度环境。

四、典型应用

  • 红外遥控与红外通信链路
  • 接近/接收器件配合(遥测、障碍检测、位置检测)
  • 光电开关、对射/漫反射检测系统
  • 夜视/可见光摄像外补红外照明(短距)
  • 智能家电、安防与自动化终端等小型化设备

五、使用建议与注意事项

  • 驱动与限流:典型测量在 20 mA 下辐射强度为 11 mW/sr,实际应用可按所需亮度与寿命要求选择驱动电流,务必使用限流电阻或恒流驱动以防过流;若采用 65 mA 为最大额定值,仅在短时或经厂商确认的脉冲条件下使用。
  • 反向耐压:Vr 最大 5 V,禁止在工作中施以超过该值的反向电压。
  • 热设计:Pd 为 130 mW,应关注器件的热阻与PCB散热,长期高电流会加速衰减,建议在靠近散热良好的铜箔区域布局。
  • 贴装与焊接:作为 SMD 器件,推荐采用标准回流工艺,遵循厂商焊接温度曲线并避免过热以保证封装与光学特性。
  • 防静电与保管:出厂贴带包装时注意防静电处理,储存和使用过程中避免强光、潮湿和静电冲击。

六、选型参考

选择时根据所需辐射强度、工作距离与环境温度确定典型驱动电流;若需更远距离或更高强度,可选择更大功率或封装带透镜的红外发射器,并注意匹配接收器的灵敏度与角度覆盖。

如需详细电气特性曲线、典型光学角度或封装图纸,请参考 EVERLIGHT 官方数据手册或联系供应商以获取完整规格与应用文件。

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