Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EVERLIGHT 19-21/GHC-YR1S2/3T 19-21
Configuration
1 options
Configuration
20+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- EVERLIGHT 19-21 / GHC-YR1S2 / 3T
- Type
- 0603
- Minimum package
- 3000 圆盘
Technical parameters
- Power
- 95mW
- Electronic Component
- Electronic Component
- Electronic Component
- EVERLIGHT
- Electronic Component
- 19-21/GHC-YR1S2/3T
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- 520nm~535nm
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 0.019g
- Electronic Component
- 1
- LED
- 199mcd
- LED
- 110°
- LED
- Electronic Component
- Electronic Component
- BM0000278920
- Electronic Component
- 518nm
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：19-21/GHC-YR1S2/3T LED
一、基本信息
19-21/GHC-YR1S2/3T 是一款由台湾亿光(EVERLIGHT)生产的高效能表面贴装型发光二极管（LED）。其采用0603（1608公制）封装，适用于多种电子应用，尤其是在需要小型化和高亮度的场合。此款LED具备卓越的光电性能，广泛应用于背光源、指示灯、显示屏、以及各种消费电子产品。
二、产品参数
- 颜色：绿色
- 透镜颜色：无色
- 透镜透明度：透明
- 毫烛光等级：199mcd（典型值），提供良好的可视亮度
- 透镜样式：矩形，带平顶，适合各种设计需求
- 透镜尺寸：1.20mm x 0.80mm，紧凑型设计
- 电压 - 正向 (Vf)（典型值）：3.3V，确保在运行时的稳定性
- 电流 - 测试：20mA，适合多种电源配置
- 视角：110°，提供广泛的发光范围
- 波长 - 主：528nm，适合寻求特定颜色输出的应用
- 波长 - 峰值：518nm，确保色彩的准确性
- 封装/外壳：0603（1608公制），符合行业标准的迷你封装
- 大小 / 尺寸：1.60mm 长 x 0.80mm 宽
- 高度（最大值）：0.80mm，适合狭小空间的安装需求
三、功能特点
高亮度输出：其199mcd的光强表现使得19-21/GHC-YR1S2/3T LED成为理想的亮度源，可用于户内外指示灯和显示屏的背光源。
宽视角设计：110°的宽视角特性使得LED在使用时，即使在较远的距离也能保持清晰可见，适合多种角度的视觉效果需求。
稳定高效：3.3V的正向电压与20mA的电流测试标准，确保了其在高负载时的稳定表现，适合大批量的工业生产线使用。
适应性强：提供的透镜为透明设计，使得LED可以与各种颜色和材料搭配，灵活应用于多种环境下。
小巧封装：0603封装尺寸使其适用于空间受限的应用场景，能够满足现代电子设备对体积小型化的需求。
四、应用领域
消费电子：用于各种智能手机、平板电脑及其他便携设备的指示灯和背光源。
汽车电子：可应用于汽车仪表照明、开关指示灯及装饰性LED灯。
家电产品：适合用于冰箱、洗衣机等家电的状态指示灯。
安防和照明：在互联网时代的智能安防领域，LED用于传感器指示和报警系统的可视化提醒。
广告和招牌：可用于广告设备的产品展示和招牌照明，提升视觉吸引力。
五、总结
19-21/GHC-YR1S2/3T LED是现代电子设计中不可或缺的光源解决方案，凭借其出色的光性能、紧凑的封装设计和广泛的应用潜力，已成为行业内广受欢迎的选择。无论是用于高科技消费电子产品，还是工业设备，台湾亿光（EVERLIGHT）的这款LED均能为用户提供与众不同的高质量服务。通过合理搭配和设计，此LED将助力创造出令人惊艳的产品亮点。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
