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ElecSuper BSS138K
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Elec Super BSS138K
- Type
- ELECSUPER
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ELECSUPER
- Electronic Component
- BSS138K
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.021g
- Electronic Component
- 1
- Electronic Component
- BM0230063712
- Power Dissipation(Pd)
- 417mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 60V
- Capacitor(Ciss)
- 25pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSS138K 产品概述
BSS138K（品牌：ElecSuper / 静芯微）是一款小功率N沟增强型场效应管，采用SOT-23封装，适用于低电流、开关与电平转换等小信号场合。器件在紧凑封装下兼顾较高耐压与低输入电容的特点，便于高速开关与混合信号电路的集成。
一、主要特性
- N沟道增强型MOSFET，逻辑电平可驱动，栅极阈值Vgs(th)典型约1.0V（Ib=250µA）。
- 漏源耐压（Vdss）：60V，适用中低电压场合的开关和保护用途。
- 连续漏极电流（Id）：400mA（器件热限及封装散热条件下）。
- 低到中等导通电阻RDS(on)：1.5Ω @ Vgs=10V，用于小功率负载开关。
- 封装：SOT-23，便于表面贴装与自动化装配。
二、关键电参数
- Vdss：60V
- Id（连续）：400mA
- Pd（耗散功率）：417mW（封装与PCB散热条件相关）
- RDS(on)：1.5Ω @ Vgs=10V
- Vgs(th)：1.0V @ Id=250µA
- 总栅电荷Qg：650pC @ Vgs=4.5V（栅驱动能量与开关损耗评估参考）
- 输入电容Ciss：25pF；输出电容Coss：9.7pF；反向传输电容Crss：2.2pF
三、封装与引脚
- 标配SOT-23三引脚封装，适合PCB面积受限的设计。不同厂家封装引脚序列可能略有差异，请以厂家数据手册的封装图为准以确认G/D/S的准确位置和焊盘尺寸。
四、典型应用场景
- 小信号开关与低电流负载控制（例如继电器/LED驱动的前级）。
- 电平移位与逻辑接口（需注意在低Vgs下的RDS(on)变化）。
- 便携设备与电源管理的小功率路径切换。
- 过流/反向保护与简单功率控制电路。
五、使用建议与注意事项
- 由于SOT-23封装热阻较大，耗散功率（Pd=417mW）受PCB铜箔面积和环境温度影响显著，长期工作时需对额定电流与功耗进行热沉降额定（derating）。
- Qg较大（[email protected]），在需要快速开关或高频驱动时，门极驱动能力与驱动损耗需评估，以免驱动器过载或开关损耗增大。
- 在3.3V或更低逻辑电平下工作时，应验证RDS(on)是否满足系统损耗要求；若需更低导通电阻，可考虑更高Vgs驱动或选用低RDS(on)替代器件。
- 注意静电放电防护，正确的焊接与处理流程可降低器件失效风险。
六、选型与替代建议
- 若应用侧重更低的导通损耗或更大持续电流，应选择RDS(on)更低或功率封装更好的MOSFET。
- 如需要更快的开关速度、较小Qg和更低Ciss的器件，可在同类逻辑场效应管中比对Qg/Ciss参数以优化驱动与效率。
总结：BSS138K以其60V耐压、SOT-23小封装和适中的导通电阻，适合空间受限的低功率开关与接口电路。但在高开关频率、大电流或高功耗场合，应重点考虑热管理与门极驱动能力，并以厂家最新数据手册为最终依据。
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