WMSIC Electronic Components

ElecSuper ESE3401AY

ModelESE3401AY
PackageSOT-23
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super ESE3401AY
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
ESE3401AY
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.059g
Electronic Component
1
Electronic Component
BM0264599821
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.4W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESE3401AY 产品概述

一、产品简介

ESE3401AY 是 ElecSuper(静芯微)推出的一款高性能 P 沟道功率 MOSFET,专为中低电压、高效能量转换与开关应用设计。器件采用 SOT-23 封装,单通道 P 沟道结构,适合用作高侧开关、负载开关及各种电源管理场合,在体积受限的消费和工业电子产品中具有良好适配性。

二、主要参数

  • 类型:P 沟道 MOSFET(单通道)
  • 汲-源耐压 Vdss:-30 V
  • 连续漏极电流 Id:-4.2 A
  • 导通电阻 RDS(on):42 mΩ @ VGS = -10 V;49 mΩ @ VGS = -4.5 V
  • 阈值电压 VGS(th):-0.8 V @ ID = -250 µA
  • 总栅极电荷 Qg:9.4 nC @ VGS = 4.5 V
  • 输入电容 Ciss:954 pF
  • 输出电容 Coss:54 pF
  • 反向传输电容 Crss:77 pF
  • 耗散功率 Pd:1.4 W
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23
  • 品牌:ElecSuper(静芯微)

三、关键特性与优势

  • 低导通电阻:在 VGS = -10 V 时 RDS(on) 仅 42 mΩ,可在需要较大电流且对导通损耗敏感的场合显著降低功耗与发热。
  • 适用低电压驱动:在 VGS = -4.5 V 时 RDS(on) 49 mΩ,便于与常见逻辑电平或驱动电压配合使用,适合单片机直接驱动或带电池供电的系统。
  • 快速开关性能:中等的栅极电荷(Qg = 9.4 nC)和平衡的寄生电容(Ciss、Crss、Coss)使其在开关频率较高时具有较好的综合表现。
  • 宽温度范围与紧凑封装:-55~+150 ℃ 的工作温度配合 SOT-23 小封装,适合工业级与便携设备的苛刻环境和空间限制。

四、典型应用场景

  • DC/DC 转换器中的高侧开关或同步整流控制
  • 电源管理模块与负载开关(手动/自动断电)
  • 开关电路与继电器驱动补偿元件
  • LED 驱动器中的电源隔离与调光控制
  • 小型电机控制模块与驱动保护电路
  • 各类便携式及工业控制设备的高侧开关方案

五、封装与热设计建议

虽然 SOT-23 能满足空间受限的设计需求,但其热阻相对较高,器件 Pd 标称 1.4 W 在无散热条件下使用会受限于 PCB 设计:

  • 建议在器件底部与连接引脚处增加铜箔面积以扩散热量,必要时在底层增加散热平面与过孔。
  • 在高功率工况或持续大电流应用中应评估结温,必要时限制器件电流或选择更大封装版本以保证可靠性。

六、使用建议与注意事项

  • 作为 P 沟道器件,ESE3401AY 在“导通”时要求 VGS 为负(相对于源极),在实际电路中常用于高侧开关,注意源极通常接向更正的电源端。
  • 推荐在希望达到最低 RDS(on) 时采用接近 -10 V 的栅压;若仅能提供 -4.5 V 驱动,也可满足较低功耗要求,但要注意导通损耗增大。
  • 关注开关损耗与栅极驱动能力:Qg 与 Ciss 表明在高频切换时驱动功率和驱动器选择应校核,以避免驱动器过热或开关时间受限。
  • 器件的最大 VGS 和反向极限值在此规格摘要中未列出,设计时请参考完整器件手册以确认绝对最大额定值及浪涌保护要求。

七、典型电路建议

  • 高侧负载开关:源接正电源,漏接负载,栅极通过驱动或上拉实现对 VGS 的拉低以导通。为抑制瞬态,可并联合适的 RC 网络或栅极电阻以降低振铃。
  • 反并联二极管考虑:器件包含体二极管,布局时应考虑反向恢复特性对电路的影响,必要时并联肖特基或加阻尼网络。

总结:ESE3401AY 在 SOT-23 小封装下提供了兼顾低导通阻抗与合理开关性能的 P 沟道 MOSFET 方案,适合多种电源管理与高侧开关应用。设计时结合驱动电压、开关频率与 PCB 热设计进行权衡,可获得良好的能效与可靠性。

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