WMSIC Electronic Components

ElecSuper ESDA6V1W5T1G

ModelESDA6V1W5T1G
PackageSOT-353
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super ESDA6V1W5T1G
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
ESDA6V1W5T1G
Electronic Component
1
Package
SOT-353
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.031g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
90pF
Electronic Component
BM0265117745
Operating Temperature
40℃~+125℃
Voltage
13V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESDA6V1W5T1G — 四路单向ESD/瞬态抑制器产品概述

一、产品简介

ESDA6V1W5T1G 是 ElecSuper(静芯微)推出的一款四路单向瞬态电压抑制器,专为接口与信号线的静电放电(ESD)与瞬态浪涌保护设计。器件采用小型 SOT-353 封装,工作温度范围宽(-40℃~+125℃),符合 IEC 61000-4-2 等级的静电防护要求,适合移动终端、消费电子、工业控制等对体积和保护性能有要求的应用场景。

二、主要规格参数

  • 极性:单向(单极向导通,反向截止)
  • 通道数:四路独立保护
  • 反向关断电压(Vrwm,典型):5V(Max)
  • 击穿电压(VBR,最小):6.0V
  • 钳位电压(典型):9.5V(测量条件下,如 8/20µs 波形时对应典型 Ipp)
  • 峰值脉冲电流(Ipp):8A(8/20µs 为典型脉冲能力)
  • 反向漏电流(Ir):约 1µA
  • 结电容(Cj):约 90pF(每通道典型值)
  • 峰值脉冲功率(器件级别参考):Ppp 可达示例值 150W(需参照器件数据表与应用布局验证)
  • 工作温度:-40℃ ~ +125℃
  • 标准与等级:IEC 61000-4-2 兼容(具体等级/级别依据实际测试结果)
  • 封装:SOT-353

注:规格中钳位电压、峰值脉冲电流等参数与测试波形、驱动条件、PCB 布局、热阻等密切相关,设计时应参考厂商完整数据手册与测试曲线。

三、保护特性与工作机理

ESDA6V1W5T1G 采用稳压型钳位结构,在被保护线上出现正向瞬态电压时迅速导通,将能量钳位到安全电压(典型 9.5V),从而保护下游电路元件不被高电压瞬态损伤。单向结构适合对地参照的信号/电源保护,反向状态下呈高阻,保证正常工作时的微小泄漏电流(约 1µA)。四路独立设计方便多信号线并排保护,节省 PCB 空间。

四、封装与布局建议

SOT-353 小型封装适用于空间受限的应用,但对热散与焊盘设计要求较高:

  • ESD 二极管应尽量靠近被保护的连接器或接口放置,最短且最宽的走线连至管脚,以减少串联电感和电阻。
  • 将器件的接地端直接短线返回到系统地(GND),优先使用多层 PCB 的地平面或多颗过孔(vias)降低回流阻抗。
  • 对于高能脉冲建议增加 PCB 铜箔面积或采用散热垫,必要时在 PCB 层间做热通孔改善散热。

五、应用场景

  • 移动设备与便携终端(按键、耳机插孔、数据口保护)
  • USB/串口/音频等低电压信号接口的浪涌与 ESD 防护(需注意 Cj 对高速信号的影响)
  • 工业控制器、仪表的输入接口防护
  • 摄像头、显示模组接口保护

注意:90pF 的结电容对某些高速差分信号(如 USB2.0 高速、MIPI 等)可能造成信号完整性影响,针对高速接口请评估电容值对带宽的限制或选择低容型保护器件。

六、设计注意事项与验证

  • 在最终方案中应做实际 ESD/浪涌测试(IEC 61000-4-2、8/20µs 等),以验证 PCB 布局与接地方式下的实际保护能力。
  • 对于需要更高瞬态承受能力的场合,参照数据表检查器件在不同脉冲波形和重复脉冲下的极限值,必要时增加串联电阻、气体放电管或多级保护方案。
  • 留意工作电压(Vrwm)与被保护电路的工作电压匹配,避免在正常工作时触发钳位。

七、结论

ESDA6V1W5T1G 提供四路单向、体积小、响应快的瞬态抑制能力,适合多种消费电子与工业接口的 ESD/浪涌保护。其典型参数(Vrwm≈5V、VBR≥6V、钳位≈9.5V、Ipp≈8A)在合理 PCB 布局下可为系统提供可靠防护。设计时请结合具体信号带宽、热管理与实测验证,选择最合适的保护与布板方案。若需更详细的测试曲线、封装尺寸或应用参考电路,请参考 ElecSuper 官方数据手册或联系技术支持。

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