Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ElecSuper 2N7002BK
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Elec Super 2N7002BK
- Type
- ELECSUPER
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ELECSUPER
- Electronic Component
- 2N7002BK
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.023g
- Electronic Component
- 1
- Electronic Component
- BM0234656560
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2N7002BK 产品概述
一、概述
2N7002BK 为 ElecSuper（静芯微）出品的一款小信号 N 沟道增强型 MOSFET，单管 SOT-23 封装，适合低电流、开关与信号控制场合。该器件耐压 60V，连续漏极电流标称 300mA，具有低栅极电荷和小输入电容，便于高速开关且易于与逻辑电平直接驱动。
二、主要参数
- 类型：N 沟道 MOSFET（单个）
- 漏源电压 Vdss：60V
- 连续漏极电流 Id：300mA
- 导通电阻 RDS(on)：1.85Ω @ Vgs=10V；2.05Ω @ Vgs=4.5V
- 耗散功率 Pd：350mW
- 阈值电压 Vgs(th)：1.6V @ ID=250µA
- 总栅极电荷 Qg：1.8nC @ Vgs=4.5V
- 输入电容 Ciss：28pF；输出电容 Coss：11pF；反向传输电容 Crss：4pF @25V
- 工作结温度：-55℃ ~ +150℃
- 封装：SOT-23
三、特点与优点
- 耐压 60V，适用高压侧小功率开关场景；
- 低栅极电荷（1.8nC），开关损耗小，能满足频繁切换的应用；
- 小尺寸 SOT-23 封装，适合空间受限的消费类与工业电子产品；
- 低输入、电容值有利于降低驱动负荷与寄生耦合。
四、典型应用
- MCU 驱动的低功耗开关（LED、微型继电器、小电机驱动的门控制）；
- 电平转换与信号开关；
- 电池供电设备的断电管理与负载切换；
- 通信设备与传感前端的保护或开关阵列。
五、使用建议与注意事项
- 虽然 Id 标称 300mA，但 SOT-23 的耗散功率仅 350mW，连续大电流使用需注意结温与 PCB 散热。举例：若 Vgs=4.5V 且 RDS(on)≈2Ω，300mA 时损耗约 0.18W（I^2·R），实际应综合考虑 Vds 和环境温度后评估；高电流或高频开关应降载或加散热措施。
- Vgs(th) 约 1.6V，但在此栅压下并不能保证低阻态，建议至少以 4.5V 驱动以获得接近数据表的 RDS(on)；若要求更低导通阻，请使用更高 Vgs 或选择低 RDS(on) 型号。
- 对于感性负载，建议在漏极侧并联续流二极管或 RC 抑制，避免器件承受高压冲击。
- 布局上尽量缩短源极与地、漏极与负载的走线，必要时在接地处使用较大铜面以改善热散。
六、可靠性与封装
SOT-23 封装利于自动贴装与批量生产，但热阻相对较大。器件的工作温度范围宽（-55℃ ~ +150℃），适应多种工业与消费场景。为确保长期可靠性，应避免持续超额发热与频繁处于边界工作点。
总结：2N7002BK 以耐压高、栅极电荷小、封装小巧为主要优势，适合各类小功率开关与信号控制应用。选型时请结合实际工作电流、开关频率与 PCB 散热条件进行热压降评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
