WMSIC Electronic Components

ElecSuper AP30P30Q-ES AP30P30Q

ModelAP30P30Q-ES
PackagePDFN3x3-8L
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super AP30P30Q-ES
Type
ELECSUPER
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
AP30P30Q-ES
Electronic Component
1
Package
PDFN3x3-8L
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0230855503
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
30W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AP30P30Q-ES 产品概述

一、产品简介

AP30P30Q-ES 是 ElecSuper(静芯微)推出的一款高性能 P 沟道功率 MOSFET,额定漏源电压 30V、连续漏极电流 39A,采用 PDFN3x3-8L 紧凑封装,适用于高频开关和功率控制场合。该器件在 10V 驱动电压下导通电阻极低(8mΩ),兼顾低损耗和高电流承载能力,适合作为高侧开关、负载切换和电源路径管理元件使用。

二、主要参数(典型/额定)

  • 类型:P 沟道 MOSFET
  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:39A
  • 导通电阻 RDS(on):8mΩ @ Vgs=10V;11.5mΩ @ Vgs=4.5V
  • 阈值电压 Vgs(th):1.4V @ 250µA
  • 总栅电荷 Qg:46nC @ Vgs=10V
  • 输入电容 Ciss:1.78nF
  • 输出电容 Coss:235pF
  • 反向传输电容 Crss:200pF
  • 功耗 Pd:30W
  • 工作结温范围:-55℃ ~ +150℃(Tj)
  • 封装:PDFN3x3-8L
  • 品牌:ElecSuper(静芯微)

三、特点与优势

  • 低导通电阻:在 10V 驱动下 8mΩ 的低 RDS(on) 有效降低导通损耗,提高系统效率。
  • 大电流承载:39A 的连续电流能力满足高功率负载需求,适合板级高侧开关与功率分配。
  • 视在电容适中:Ciss、Coss 与 Crss 数值提供了在开关速度与驱动能耗间的良好平衡。
  • 紧凑封装:PDFN3x3-8L 有利于提高板级集成度并优化热路径布线。

四、应用建议

  • 电源路径控制与高侧负载切换(P 沟道更便于高侧实现无升压驱动)
  • 便携设备与车载辅助电源的电源管理与负载分配
  • 马达驱动、继电器替代、热敏负载开关
  • 倒灌保护与电池保护电路

五、工程注意事项

  • 栅极驱动:Qg=46nC、Ciss≈1.78nF,栅极驱动器需能提供足够电流以实现所需开关速度,必要时加栅极电阻以抑制振铃。
  • 热设计:器件 Pd=30W,但实际散热依赖 PCB 铜箔面积与底部焊盘设计,建议器件周围留出散热铜平和多层过孔以降低结壳温升。
  • PCB 布局:尽量缩短大电流回路导线长度,增大电源及接地铜皮;保证栅极走线与开关节点隔离以降低干扰。
  • 工作电压范围:器件 Vdss=30V,适用于 12V/24V 车用及工业供电场景,但应留有裕量避免瞬态超过额定值。

六、总结

AP30P30Q-ES 以其低 RDS(on)、高电流能力和紧凑封装,适合需要高侧 P 沟道开关、功率分配与电源管理的应用场景。在实际应用中,合理的栅极驱动和 PCB 散热设计能充分发挥其性能,提升系统效率与可靠性。若需进一步的电气特性曲线或封装详图,建议参考厂方详细数据手册或联系 ElecSuper 技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.