WMSIC Electronic Components

ElecSuper WNM2030-3/TR-ES WNM2030

ModelWNM2030-3/TR-ES
PackageSOT-723
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super WNM2030-3 / TR-ES
Type
ELECSUPER
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
WNM2030-3/TR-ES
Electronic Component
1
Package
SOT-723
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0258806295
Power Dissipation(Pd)
600mW
Electronic Component
Electronic Component
Electronic Component
8000
Voltage(Vdss)
20V
Capacitor(Ciss)
60pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WNM2030-3/TR-ES 产品概述

一、产品简介

WNM2030-3/TR-ES 是静芯微(ElecSuper)推出的一款小型 N 沟道功率 MOSFET,封装为 SOT-723,适用于空间受限的便携设备与电源管理场景。器件额定漏源电压 20V,面向低压、中低电流的开关与驱动需求。

二、主要性能特点

  • 漏源耐压:Vdss = 20V。
  • 连续漏极电流:Id = 900mA(引脚与封装热阻限制下需按额定耗散与温升评估)。
  • 导通电阻:RDS(on) ≈ 125mΩ(典型),最大 150mΩ @ Vgs = 4.5V。
  • 阈值电压:Vgs(th) = 0.65V @ Id=250µA,属于逻辑电平门极器件。
  • 功耗耗散:Pd = 600mW(SOT-723 封装,散热能力有限,需注意版上散热)
  • 栅极特性:总栅极电荷 Qg = 1nC @ Vgs=4.5V,输入电容 Ciss = 60pF,反向传输电容 Crss = 12pF,输出电容 Coss = 22pF。

三、典型应用场景

  • 便携式和电池供电设备的低侧开关与电源切换;
  • LED 驱动与小电流负载开关;
  • 便携式充电器、移动终端电源管理、物联网节点的功率开关;
  • 低压电平移位、保护电路与负载断路控制。

四、设计与布局建议

  • 封装为 SOT-723,热阻较高,建议在 PCB 使用较大铜面积或多层铜铺铜以提高散热;必要时使用散热过孔连通内层铜。
  • 在开关应用中,得益于低 Qg 和小 Ciss,驱动能耗低,适合有限驱动能力的 MCU 直接驱动;高速开关时仍建议加上门极电阻以抑制振铃和减小 EMI。
  • 在接近最大额定电流工作时,请按实际工作点计算 I^2·RDS(on) 损耗并考虑环境温度与散热条件,必要时进行额外的降额设计。

五、封装与采购信息

  • 封装:SOT-723(超小型表面贴装),适合高密度 PCB 布局;
  • 品牌:ElecSuper(静芯微);型号:WNM2030-3/TR-ES;包装与最小订购量请参照厂商或经销商报价单。

此器件以小体积、低门极驱动和适中的导通电阻为主要卖点,适合对体积和栈板成本敏感、需在 20V 以下进行中低电流开关控制的应用。使用时请务必结合封装热特性与 PCB 散热设计进行可靠性评估。

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