WMSIC Electronic Components

ElecSuper 2N7002W

Model2N7002W
PackageSOT-323
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super 2N7002W
Type
ELECSUPER
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
2N7002W
Electronic Component
1
Package
SOT-323
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0264576550
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N7002W 产品概述

一、产品简介

2N7002W 是由 ElecSuper(静芯微)提供的一款小功率 N 沟增强型场效应管(MOSFET),采用 SOT-323 封装,面向低电压逻辑控制与小电流开关场景。器件具有 60V 漏源耐压与较低的栅极电荷,适合用于便携设备、信号开关和接口电平转换等应用。

二、主要规格

  • 类型:N 沟道 MOSFET(增强型)
  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:300mA
  • 导通电阻 RDS(on):1.85Ω @ Vgs=10V;2.05Ω @ Vgs=4.5V
  • 最大耗散功率 Pd:350mW
  • 阈值电压 Vgs(th):典型 1.6V
  • 总栅极电荷 Qg:1.8nC @ Vgs=4.5V
  • 输入电容 Ciss:28pF;输出电容 Coss:11pF;反向传输电容 Crss:4pF
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOT-323(小尺寸)

三、主要特性

  • 较高的耐压(60V),适合中等电压场合。
  • 低栅极电荷与较小输入电容,有利于开关速度与驱动能耗的控制。
  • SOT-323 小封装,适合空间受限的电路板布局。
  • 额定耗散功率较低(350mW),更适合小电流或间歇性开关应用。

四、典型应用

  • 低电流开关与信号隔离(继电器驱动前级、开关晶体管)
  • 电平移位与逻辑接口(TTL/CMOS 电平)
  • 便携式与手持设备的小功率负载开关
  • 保护与熔丝替代电路中的低功耗场合

五、使用建议与注意事项

  • 注意功率与热耗散:SOT-323 封装散热受限,连续靠近最大 Id 时需在 PCB 上增加铜箔散热或进行热裕量计算,避免长期工作在高温或高功耗条件下。
  • 驱动电压选择:在 Vgs=4.5V 至 10V 区间导通电阻变化不大,但对于更低损耗建议提供接近 10V 的栅极驱动;若驱动电压较低,应检查 RDS(on) 是否满足系统电压降要求。
  • 开关与 EMI:低 Qg 有助于降低驱动能耗,但开关瞬态仍可能产生电压尖峰,建议在需要时加缓冲网络(阻容抑制)或 TVS 进行抑制。
  • ESD 与可靠性:小型封装对手工焊接和机械应力敏感,建议按制造商推荐的焊接与回流温度曲线操作,避免过热或机械损伤。

六、封装与环境

  • 封装:SOT-323,适合高密度表面贴装。
  • 工作温度:-55℃ 至 +150℃,满足大多数商业与工业级环境需求。
  • 建议参考 ElecSuper 官方数据手册以获取完整的引脚排列、封装尺寸、典型特性曲线及推荐的 PCB 布局与焊接资料。

如需替代器件选型、等效电路示例或基于该型号的应用参考电路,可提供具体应用场景以便进一步分析与建议。

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