WMSIC Electronic Components

ElecSuper BSC030N08NS5(ES) BSC030N08NS5

ModelBSC030N08NS5(ES)
PackagePDFN-8L(5x6)
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super BSC030N08NS5(ES)
Type
ELECSUPER
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
BSC030N08NS5(ES)
Electronic Component
1
Package
PDFN-8L(5x6)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.177g
Electronic Component
1
Electronic Component
BM0264998903
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
139W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSC030N08NS5(ES) 产品概述

一、产品简介

BSC030N08NS5(ES) 是 ElecSuper(静芯微)推出的一款高电流、低导通阻抗的 N 沟道功率 MOSFET。该器件设计用于中高功率开关应用,兼顾低导通损耗与良好的开关性能,适合 DC/DC 转换、负载开关、开关电路、继电器驱动、LED 驱动、电机控制与电源管理等场景。器件封装为 PDFN-8L(5×6),适合高密度 PCB 布局与良好的热性能设计。

二、主要参数(典型/额定)

  • 类型:N 沟道 MOSFET
  • 漏源电压 Vdss:100 V
  • 连续漏极电流 Id:138 A
  • 导通电阻 RDS(on):3 mΩ @ Vgs = 10 V(测试电流 30 A)
  • 阈值电压 Vgs(th):2.7 V @ ID = 250 μA
  • 栅极总电荷 Qg:49 nC @ Vgs = 10 V
  • 输入电容 Ciss:3.658 nF
  • 输出电容 Coss:1.536 nF
  • 反向传输电容 Crss:19 pF
  • 功耗 Pd:139 W
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:PDFN-8L(5×6)
  • 品牌:ElecSuper(静芯微)

三、性能亮点

  • 低导通阻抗:3 mΩ 的 RDS(on) 在 10 V 栅压下能显著降低导通损耗,适合高电流路径,提升效率并降低发热。
  • 高电流承载能力:额定连续漏极电流高达 138 A,适合电源和电机等需要较大电流的应用。
  • 紧凑封装:PDFN-8L(5×6)提供了小尺寸与较好的热流出路径,利于高密度电路板设计。
  • 平衡的开关特性:较大的输入电容(Ciss)与中等的栅极电荷(Qg=49 nC)意味着器件在开关速度与驱动要求间取得平衡,适用于中高频开关应用。

四、典型应用场景

  • DC/DC 转换器(同步整流和功率开关)
  • 负载开关与电源管理模块
  • 电机控制模块与驱动器(半桥/全桥拓扑)
  • LED 驱动与照明电源
  • 继电器替代与功率开关电路
  • 各类功率电子模块中的高电流开关元件

五、驱动与布局建议

  • 门极驱动电压:为获得规格标称的低 RDS(on),建议驱动电压接近 10 V(典型门极10 V 驱动)。Vgs(th)=2.7 V 表示该器件并非严格的逻辑电平型,3.3 V 或 5 V 驱动不能保证最低导通阻抗。
  • 驱动能力:Qg = 49 nC 属于中等偏高水平,要求门极驱动器能提供较大的瞬时电流以获得快速开关。根据工作频率选择合适的驱动器与栅极电阻以平衡开关损耗与 EMI。
  • PCB 布局:尽量缩短功率回路(电源—MOSFET—电感/负载)的环路路径,增大器件散热铜箔面积并布置多孔热通道(via),以降低热阻并提升散热效率。
  • 栅极防护:建议在栅极串联适当阻值的栅极电阻以抑制振铃,必要时并联 TVS 或 RC 缓冲网络进行过压与瞬态保护。

六、热管理与可靠性

  • Pd 值 139 W 为器件在理想散热条件下的额定耗散能力,实际应用中需根据 PCB 散热面积、铜厚、散热器或风冷条件重新评估结壳温度与允许持续电流。
  • 工作温度覆盖 -55 ℃ 至 +150 ℃,适用于恶劣环境,但长寿命与高可靠性运行仍依赖于良好的热设计与合适的工作点。
  • 器件为敏感半导体,请在贴装与测试过程中注意 ESD 防护与湿度管理(如必要,遵循厂商的湿敏等级与回流焊工艺建议)。

七、设计注意事项与选型提示

  • 若系统以 3.3 V 或 5 V 门极为主,需确认在该栅压下的 RDS(on) 能否满足热与效率要求,否则应采用专用门极驱动或选择逻辑电平型 MOSFET。
  • 在高频切换场合,除了关注导通损耗,还需关注开关损耗(与 Qg、Coss、Crss 相关)并做综合评估。
  • 封装虽紧凑,但高电流设计需保证大量铜箔与散热通道,避免过热导致性能退化或失效。

综上所述,BSC030N08NS5(ES) 是一款面向中高功率开关应用的高电流、低导通阻抗 MOSFET,适合需要高效率与紧凑布局的电源与驱动系统。在具体应用中,合理的栅极驱动与 PCB 热管理设计将能充分发挥其性能优势。若需进一步的电气特性曲线、封装引脚图或热阻数据,请联系厂商资料或索取完整规格书。

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