WMSIC Electronic Components

ElecSuper A7

ModelA7
PackageSOD-123FL
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super A7
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
A7
Electronic Component
1
Package
SOD-123FL
Electronic Component
General Purpose Diode
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0234653471
Current
1A
Diode
1
Current(Ir)
2uA
(Vf)
1V
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
1kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ElecSuper(静芯微) 通用二极管 A7 产品概述

一、产品简介

ElecSuper(静芯微)A7系列通用二极管是一款单颗独立封装的高压小型整流器,封装形式为 SOD-123FL,专为中小功率、高反向电压应用设计。器件具有较低的正向压降和极低的反向漏电流,适合在高压阻断与整流场景中提供可靠的单极性整流保护与开关功能。

二、主要规格

  • 二极管数量:1个独立式
  • 正向压降(Vf):1.0 V(典型)
  • 直流反向耐压(Vr):1000 V(1 kV)
  • 最大整流电流:1 A(连续)
  • 反向电流(Ir):2 μA(在额定Vr或规定测试条件下)
  • 封装:SOD-123FL
    以上参数为关键电气特性,实际使用时请以厂家最新数据手册为准。

三、产品特点与优势

  • 高耐压:1 kV的反向耐压使器件适应高压整流、阻断及浪涌抑制场合。
  • 低正向压降:1 V的Vf在保持较小功耗的同时,提高整流效率,适于1 A级别的整流要求。
  • 极低漏电:2 μA的反向电流有利于降低待机或高阻态下的漏耗,适合对漏电有严格要求的系统。
  • 小型封装:SOD-123FL兼顾尺寸与焊接可靠性,适合表面贴装生产线与空间受限的板级设计。

四、典型应用场景

  • 开关电源高压整流与次级保护
  • 汽车电子及工业电源中的高压阻断与回路保护
  • 浪涌抑制、反向保护与逆向电压隔离
  • 通信与测试设备中的高压整流与采样保护

五、设计与使用建议

  • 散热考虑:在接近1 A整流电流时,请评估PCB散热路径与环境温度,必要时增大铜箔面积或采用散热片。
  • 布局要点:尽量缩短高电流回流路径,减小串联电感与接触阻抗,焊盘与焊点应保证可靠焊接。
  • 并联与替换:若需要更大电流,可并联相同型号器件并对称布局;对低正向压降需求更高的场合,可考虑肖特基二极管作为替代。
  • 环境与可靠性:请遵循厂家推荐的回流焊温度曲线与储存条件,避免超过规格书的最大结温与应力,确保持久可靠运行。

六、结论

ElecSuper A7系列通用二极管以其1 kV耐压、1 V正向压降与2 μA低漏电的组合特性,适合用于对高压阻断与中等整流电流有要求的多种应用场景。结合SOD-123FL的表贴封装,便于自动化组装与板级布局,是高压整流与保护电路的实用选择。购买与批量设计前,建议下载并核对最新规格书及封装尺寸图,以确保参数与热管理满足设计需求。

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