WMSIC Electronic Components

ElecSuper NCE3400-ES NCE3400

ModelNCE3400-ES
PackageSOT-23
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super NCE3400-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
NCE3400-ES
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0258810072
Power Dissipation(Pd)
1.4W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
550pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCE3400-ES 产品概述

一、产品简介

NCE3400-ES 是 ElecSuper(静芯微)推出的一款低电阻、低门电荷的 N 沟道场效应管,单颗 SOT-23 封装,适用于小功率开关与电源管理场合。器件额定漏源电压为 30V,适配常见 12V/24V 及 USB 电源拓扑的小功率端口与负载开关需求。

二、主要参数

  • 类型:N 沟道 MOSFET(单颗)
  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:5.8A(封装与散热限制下)
  • 导通电阻 RDS(on):21mΩ @ Vgs=10V;25mΩ @ Vgs=4.5V;33mΩ @ Vgs=2.5V
  • 耗散功率 Pd:1.4W(SOT-23 封装,实际需参考 PCB 散热)
  • 阈值电压 Vgs(th):1.0V @ ID=250µA
  • 总栅极电荷 Qg:6.7nC @ Vgs=4.5V
  • 输入电容 Ciss:550pF;输出电容 Coss:62pF;反向传输电容 Crss:48pF
  • 封装:SOT-23;品牌:ElecSuper(静芯微)

三、关键特性

  1. 低导通电阻:在常见的 4.5–10V 驱动下具有较低的 RDS(on),有利于降低导通损耗与发热。
  2. 中等栅极电荷:Qg=6.7nC 在 4.5V 驱动下,切换损耗与驱动器选型需考虑,但对于中低频开关应用是可接受的。
  3. 小封装高集成度:SOT-23 适合体积受限的消费电子与便携式设备,可实现紧凑布局。
  4. 宽温度与电压裕量:30V 的耐压使其可用于多种电源轨道和瞬态场景。

四、典型应用场景

  • 便携设备与电源管理:作为负载开关、电子熔断或功率路径控制元件。
  • DC-DC 转换器与同步整流(小功率级):在合理驱动与散热条件下用于提高效率。
  • 电机驱动与继电器驱动的低侧开关。
  • 过压/反接保护及理想二极管替代方案(配合控制器使用)。

五、驱动与热设计注意事项

  • 驱动电压:为获得最低 RDS(on) 建议在可行条件下使用 ≥4.5V 的门极驱动;在 2.5V 逻辑电平下仍可工作但损耗增大。
  • 切换损耗:Qg 与 Ciss 指示在高频开关时需要更强的驱动能力与合适的驱动器以降低开关损耗与电磁干扰。
  • 散热管理:SOT-23 封装 Pd 为 1.4W,实际功耗能力受 PCB 铜箔面积与热阻影响,推荐在 PCB 放置大面积散热铜箔、铺地或加热孔以提升散热性能。
  • 保护建议:在应用中考虑软起动、限流及合适的滤波与压敏元件以应对浪涌与瞬态过压。

六、封装与选型建议

NCE3400-ES 以 SOT-23 小尺寸封装提供良好性价比,适合体积受限且需中等电流能力的应用。选型时请参考完整数据手册核对引脚定义、最大额定值、热阻与典型特性曲线;在高功率或高频场景,应通过实验验证器件温升与效率表现,并根据需要选择更大散热能力的封装或并联方案。

如需用于特定电路(例如同步整流或高频开关),建议提供工作电压、开关频率与 PCB 约束,便于进一步评估和给出参考电路与驱动方案。

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