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ElecSuper BSS138P
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Elec Super BSS138P
- Type
- ELECSUPER
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ELECSUPER
- Electronic Component
- BSS138P
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.021g
- Electronic Component
- 1
- Electronic Component
- BM0230063713
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 417mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSS138P 产品概述
一、概述
BSS138P（品牌：ElecSuper / 静芯微）为一款小功率N沟增强型场效应管，封装为SOT-23。器件适用于低电流开关、信号电平转换及便携式电源管理等场合。器件工作温度范围宽（-55℃ ~ +150℃），适合工业级及消费类应用。
二、主要参数（典型/额定）
- 类型：N沟道 MOSFET（增强型）
- 漏源电压 Vdss：60V
- 连续漏极电流 Id：400mA
- 导通电阻 RDS(on)：1.5Ω @ Vgs=10V
- 功耗 Pd：417mW
- 阈值电压 Vgs(th)：1.0V @ Id=250µA
- 总栅极电荷 Qg：650pC @ Vgs=4.5V
- 输入电容 Ciss：25pF；输出电容 Coss：9.7pF；反向传输电容 Crss：2.2pF
- 工作温度：-55℃ ~ +150℃
- 封装：SOT-23；数量：1片
三、性能特点与解读
- 低阈值（≈1V），便于与低电平逻辑接口直接驱动，但标称导通电阻在Vgs=10V时为1.5Ω，说明在较低栅压（如3.3V或4.5V）下导通电阻会更高，不适合大电流功率路径。
- 较高的总栅极电荷（650pC @4.5V）提示在快速开关或高频驱动时驱动电流需求较大，应评估驱动器能力与开关损耗。
- 器件耐压60V，适合中等电压场合的开关与保护应用。
- SOT-23小封装限制了热量散发，器件的最大耗散功率（417mW）要求在PCB设计时注意散热与热阻管理。
四、典型应用场景
- 信号开关与电平移位（低电流条件）
- 电池管理中的断电控制和低功耗切换
- 低频或低速的负载开关（继电器/继电器驱动侧）
- 过压/反向保护电路中的隔离元件
五、设计与使用建议
- 若应用为较大电流或需要低压降，应选择RDS(on)更低、栅电荷更小的器件；本器件适合小电流、低频场合。
- 在驱动端尽量提供较高的Vgs（接近10V）以达到标称RDS(on)，或在3.3/5V系统中进行实际测量确认导通损耗。
- PCB布线应优化散热：放置较大铜面积在焊盘处并避免热汇聚；若连续电流接近额定值，应加大散热措施。
- 在高频切换场合考虑栅极串联电阻与阻尼以抑制振铃，并评估栅极驱动器的峰值电流是否能满足Qg需求。
- 储存与焊接按SOT-23封装工艺规范进行，注意静电防护。
六、封装与订购信息
- 封装：SOT-23，适合表面贴装生产与小型化设计。
- 品牌：ElecSuper（静芯微）。订购时请确认批次和完整数据手册以获得详细的温度特性与典型电测曲线。
总结：BSS138P 以其高耐压与低阈值特性，适合中等电压、低电流的开关与信号应用；在高频或大电流场合需谨慎选型并做好驱动与散热设计。
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