WMSIC Electronic Components

ElecSuper PESD3V3S1BA-ES PESD3V3S1BA

ModelPESD3V3S1BA-ES
PackageSOD-323
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super PESD3V3S1BA-ES
Type
ELECSUPER
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
PESD3V3S1BA-ES
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.025g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
46pF
Electronic Component
BM0230063716
Operating Temperature
40℃~+125℃
Voltage
15V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD3V3S1BA-ES 产品概述

一、产品简介

PESD3V3S1BA-ES 是 ElecSuper(静芯微)推出的一款单路双向 ESD 保护器件,采用 SOD-323 小型封装,专为 3.3V 系统的接口防护设计。器件在有限空间内提供可靠的瞬态过压吸收能力,适用于工业级温度范围(-40℃ 至 +125℃),可应对 IEC 61000-4-2 所规定的静电放电冲击。

二、主要特点

  • 双向保护,支持正负极性瞬态脉冲,适合双向数据线和差分信号线路;
  • 额定反向截止电压 Vrwm = 3.3V,击穿电压 Vbr ≈ 3.5V,适配 3.3V 逻辑电平;
  • 钳位电压 Vclamp ≈ 15V,峰值脉冲电流 Ipp = 30A(8/20µs),峰值脉冲功率 Ppp = 250W;
  • 低漏电流 Ir ≤ 1µA,降低对静态功耗和模拟电路偏置的影响;
  • 结电容 Cj = 46pF,在多数控制与信号接口中提供平衡的速度与保护性能;
  • 封装 SOD-323,适合集成于空间受限的移动设备、传感器与消费电子中。

三、电气参数一览

  • 极性:双向
  • 反向截止电压(Vrwm):3.3V
  • 击穿电压(Vbr):约 3.5V
  • 钳位电压(Vclamp):约 15V(典型)
  • 峰值脉冲电流(Ipp,8/20µs):30A
  • 峰值脉冲功率(Ppp):250W
  • 反向漏电流(Ir):≤ 1µA
  • 结电容(Cj):46pF
  • 通道数:单路
  • 工作温度:-40℃ ~ +125℃
  • 防护等级:符合 IEC 61000-4-2

四、典型应用场景

  • 3.3V 数字接口保护(GPIO、UART、SPI、I2C 等);
  • 差分信号与通讯接口(RS-485、CAN 总线的端接侧需评估电容影响);
  • 移动终端、便携设备与物联网节点的外部接口防护;
  • 工业控制设备、仪表与传感器模块的浪涌/静电防护。

五、封装与可靠性

SOD-323 封装体积小,便于表面贴装(SMT)工艺自动化生产;器件设计满足工业级温度与静电抗扰度要求,适合长期稳定工作。推荐在 PCB 布局中将保护器件尽量靠近被保护的引脚布置,并提供良好接地路径以降低钳位电压和系统干扰。

六、典型应用建议

  • 对于高速信号或对带宽敏感的接口,需评估 46pF 的结电容对信号完整性的影响;若信号对延迟/失真敏感,可考虑并联阻抗或选择更低电容的保护器件;
  • 布局建议:保护器件靠近外部连接器,短且粗的接地回路以提高吸收效率;对差分线建议对称布置并保持阻抗匹配。
  • 在电源或敏感模拟路径上使用时,需确认钳位电压与系统承受能力,必要时可与限流元件配合使用以降低瞬态能量传递。

PESD3V3S1BA-ES 以其面向 3.3V 系统的专用参数、紧凑封装和工业级性能,为多类电子产品提供经济且可靠的 ESD 防护解决方案。若需详细典型曲线或封装尺寸图,请联系 ElecSuper(静芯微)获取 datasheet 与应用资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.