WMSIC Electronic Components

ElecSuper GBLC03CI-ES GBLC03CI

ModelGBLC03CI-ES
PackageSOD-323
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super GBLC03CI-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
GBLC03CI-ES
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.025g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.8pF
Electronic Component
BM0230063715
Operating Temperature
40℃~+125℃
Voltage
20V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GBLC03CI-ES 产品概述

一、产品简介

GBLC03CI-ES 是 ElecSuper(静芯微)推出的一款单路双向 ESD 保护器件,针对低压高速信号线和接口电路的瞬态过电压防护设计。器件在小型 SOD-323 封装内实现高效的脉冲能量吸收能力,适合空间受限的消费电子与通信终端应用。

二、主要性能参数

  • 极性:双向(Bidirectional)
  • 反向截止电压 Vrwm:3 V
  • 击穿电压(Vbr):3.8 V
  • 钳位电压(Vclamp,Ipp=10 A):约 20 V
  • 峰值脉冲电流 Ipp:10 A
  • 峰值脉冲功率 Ppp:200 W(瞬态)
  • 反向电流 Ir:1 μA(典型)
  • 结电容 Cj:0.8 pF(适合高速信号)
  • 通道数:单路
  • 工作温度:-40 ℃ ~ +125 ℃
  • 防护等级:满足 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)
  • 类型:ESD 抑制器

三、典型应用场景

适用于对低压双向信号线的静电与脉冲瞬态防护,包括但不限于:

  • 手持终端与移动设备的 I/O 接口
  • 传感器与触摸按键信号线
  • 通信接口与高速数据链路(需要低电容保护场合)
  • 音视频小信号路径与控制线

四、封装与可靠性

SOD-323 小型封装,便于贴片自动化生产和高密度 PCB 布局。器件在额定温度范围内具有稳定的泄放特性和低泄漏电流,适应工业级环境温度。

五、使用建议与注意事项

  • 建议将器件布局在被保护引脚与连接器/外壳之间,靠近受保护端,减小串联电感环路。
  • 对高速信号应用,请注意 PCB 阻抗匹配与最短走线以降低附加噪声。
  • 钳位电压在大电流下仍有较高电压出现,不能作为长期过压保护手段;仅用于瞬态抑制。
  • 存储与焊接按常规无铅回流工艺要求控制温度曲线,避免超出封装承受范围。

六、订购信息

型号:GBLC03CI-ES;品牌:ElecSuper(静芯微);封装:SOD-323。请在设计与采购时确认具体封装图与管脚定义,并结合实际系统浪涌条件选型。

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