WMSIC Electronic Components

ElecSuper PESD3V3L2BT-ES PESD3V3L2BT

ModelPESD3V3L2BT-ES
PackageSOT-23
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super PESD3V3L2BT-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
PESD3V3L2BT-ES
Electronic Component
1
Package
SOT-23
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.028g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
46pF
Electronic Component
BM0234666987
Voltage
12V
Electronic Component
IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESD3V3L2BT-ES 产品概述

PESD3V3L2BT-ES 是 ElecSuper(静芯微)推出的一款 SOT-23 封装、双路双向 ESD 保护器件,专为 3.3V 逻辑接口和易受静电冲击的信号线提供高效、低成本的瞬态抑制保护。器件在小体积下集成两路防护通道,满足工业、消费以及通信类终端对抗静电放电(ESD)和脉冲浪涌的需求,并符合 IEC 61000-4-2 标准。

一、主要性能与参数

  • 极性:双向(支持正负向放电)
  • 反向截止电压 Vrwm:3.3 V(适配 3.3V 信号总线)
  • 击穿电压(Vbr):3.6 V(触发导通)
  • 钳位电压:12 V(典型峰值钳位值)
  • 峰值脉冲电流 Ipp:30 A(8/20 μs 波形)
  • 峰值脉冲功率 Ppp:300 W @ 8/20 μs
  • 反向电流 Ir:1 μA(低漏电,适用于低功耗系统)
  • 结电容 Cj:46 pF(影响信号完整性,应在高速设计中评估)
  • 通道数:双路(单封装保护两条信号线)
  • 类型:ESD(瞬态电压抑制)
  • 防护等级:符合 IEC 61000-4-2 要求
  • 封装:SOT-23(节省 PCB 面积)

二、特点与优势

  • 双路双向保护:单颗元件即可实现两根双向信号线的ESD防护,节省 BOM 与布局空间。
  • 低触发电压与快速响应:3.6 V 的击穿电压保证在静电事件发生时迅速导通,保护后端电路。
  • 高能量吸收能力:300 W/8/20 μs 的峰值功率和 30 A 的脉冲电流能力,能承受常见静电与浪涌冲击。
  • 低漏电流:1 μA 的反向电流适合电池供电及低功耗应用。
  • 小封装:SOT-23 便于在空间受限的移动设备或模块化设计中使用。
  • 工业标准兼容:满足 IEC 61000-4-2,可靠性高。

三、典型应用场景

  • 3.3V 数字接口保护(如 UART、I2C、SPI 等)
  • USB、HDMI、DisplayPort 下游或辅助信号线的静电保护(需结合结电容要求评估)
  • 手机、平板、可穿戴设备、消费电子、物联网节点等对体积与成本敏感的终端设备
  • 工业控制与仪表中的低压信号端口防护

四、典型电路与布局建议

  • 保护器件应尽可能靠近外部连接器或信号入口放置,以缩短走线并降低寄生感抗。
  • 在保护器件与被保护芯片间保持短且宽的接地回流路径,降低钳位电压与环路感抗。
  • 对于高速信号,需评估 46 pF 的结电容对信号完整性的影响;必要时通过串联阻抗或差分匹配优化。
  • 建议与串联电阻、共模滤波器或线路换向元件配合使用,以增强对更复杂浪涌的吸收能力。
  • 焊盘与散热布局按 SOT-23 推荐封装图设计,保证机械与热性能。

五、封装与可靠性

PESD3V3L2BT-ES 采用 SOT-23 小封装,适合自动贴装与回流焊流程。器件出自 ElecSuper(静芯微),制造与测试流程符合行业可靠性要求,适用于商业和工业环境。设计中建议参照厂商完整数据手册进行详细的电气与热性能校核,以保证在目标应用中的长期稳定性与安全性。

总结:PESD3V3L2BT-ES 提供对 3.3V 信号线的高效双向 ESD 防护,结合小体积、低漏电和较高的能量吸收能力,是空间受限且要求抗静电性能的电子设计的理想选择。

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