WMSIC Electronic Components

ElecSuper WNM6002-3/TR-ES WNM6002

ModelWNM6002-3/TR-ES
PackageSOT-323
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super WNM6002-3 / TR-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
WNM6002-3/TR-ES
Electronic Component
1
Package
SOT-323
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0230664652
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
15pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WNM6002-3/TR-ES 产品概述

一、产品简介

WNM6002-3/TR-ES 是静芯微(ElecSuper)推出的一款小封装、低能耗的 N 沟道增强型场效应管(MOSFET)。器件额定漏源电压 60V,适用于中低电流、高压差的开关与保护应用。封装为 SOT-323,体积小、适合便携与密集布板设计。

二、主要参数(典型/额定)

  • 类型:N 沟道 MOSFET
  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:300mA
  • 导通电阻 RDS(on):约 1.8Ω @ Vgs=10V;约 2Ω @ Vgs=4.5V(200mA 条件下典型值)
  • 阈值电压 Vgs(th):1.1V @ Id=250µA
  • 总耗散功率 Pd:350mW
  • 栅极电荷 Qg:1.6nC @ Vgs=4.5V
  • 输入电容 Ciss:15pF;反向传输电容 Crss:1.3pF;输出电容 Coss:3.3pF
  • 封装:SOT-323
  • 数量:单个(1 个 N 沟道)

三、产品特点与优势

  • 低导通电阻、低损耗:在合理栅压下 RDS(on) 较低,适合 100~300mA 级别负载,导通损耗可控。
  • 低栅电荷与小电容:Qg 和 Ciss 均较小,驱动功耗低,易于实现快速开关和降低驱动器负担。
  • 高电压能力:60V 漏源耐压满足工业级、汽车电子外围或电池组高压侧的开关需求(请按实际系统余量选型)。
  • 微型封装:SOT-323 适用于空间受限的消费电子与可穿戴设备。

四、典型应用场景

  • 便携设备电源开关与电源路径控制
  • 小电流 DC-DC 开关及同步整流场合(需评估功耗)
  • 反向保护、负载切断与电池管理外围开关
  • 通信与传感器模块的电源控制与保护

五、使用建议与注意事项

  • 栅极驱动:器件在 Vgs≈4.5V 即能导通,驱动电荷小;若采用 10V 驱动,能进一步降低 RDS(on)。请根据系统允许的 Vgs 选择合适驱动电压,避免超过器件允许的最大 Vgs(详见完整数据手册)。
  • 热管理:器件耗散功率 Pd=350mW,SOT-323 热阻较大,高电流持续工作时建议在 PCB 上增加铜箔散热并减少环境温升。示例:在 300mA、RDS(on)=1.8Ω 条件下导通损耗约 0.162W,仍需考虑温升余量。
  • 开关控制:建议在快切换场合串联小阻(10–100Ω)以限制瞬时电流与抑制振铃,同时保持 PCB 良好接地布局以降低寄生电感影响。
  • ESD 与焊接:小封装对静电敏感,生产与维修过程中注意防静电措施;焊接工艺请参考厂方回流曲线以防损伤封装。

六、封装与订购

  • 封装:SOT-323(小型封装,适合自动贴片)
  • 订购型号:WNM6002-3/TR-ES(由 ElecSuper 出品)
  • 备注:批量采购或特殊包装需求请联系供应商获取详细供货与测试资料。

七、总结

WNM6002-3/TR-ES 是一款面向小电流、高压差场合的微功耗 N 沟道 MOSFET,具有低栅电荷、小输入电容和微型封装的优势,适合便携电源、电源路径控制与小功率开关应用。在选型时应结合实际工作电流、栅极驱动电压与散热条件评估器件性能,确保长期可靠工作。若需更完整的典型电路、封装尺寸和绝对最大额定值,请参阅厂方完整数据手册。

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