WMSIC Electronic Components

ElecSuper SMF3.3A

ModelSMF3.3A
PackageSOD-123FL
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super SMF3.3A
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
SMF3.3A
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.042g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0265825492
Operating Temperature
55℃~+150℃
Voltage
8.8V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
500uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF3.3A 瞬态抑制二极管(TVS)产品概述

SMF3.3A是静芯微(ElecSuper)推出的单向瞬态抑制二极管(TVS),专为3.3V及以下低电压电子系统设计,具备小型化封装、宽温耐受、高脉冲防护能力等核心优势,可有效抑制ESD、EFT、雷击等瞬态过压脉冲,保护敏感电子元器件免受损坏。

一、产品核心定位与应用场景

SMF3.3A针对低电压系统的瞬态过压防护需求,覆盖多领域典型应用:

  • 消费电子:智能手机、平板电脑、智能穿戴设备的USB、HDMI、音频接口防护;
  • 工业控制:PLC模块、传感器节点、工业通信接口(如RS485)的过压防护;
  • 汽车电子:车载摄像头、CAN/LIN总线接口、车载信息娱乐系统的宽温环境防护(适配-55℃~+150℃工作温度);
  • 通信设备:路由器、交换机、光模块的端口瞬态防护,满足电磁兼容(EMC)要求。

二、关键电气参数解析

SMF3.3A的参数设计精准匹配3.3V系统的防护需求,核心参数意义如下:

  1. 极性与工作电压:单向导通,反向截止电压(Vrwm)=3.3V——当系统正常工作电压≤3.3V时,TVS处于截止状态,不干扰电路正常运行;
  2. 击穿与钳位特性:击穿电压(Vbr)=6.58V(典型值),钳位电压(Vc)=8.8V——瞬态过压超过Vbr时,TVS快速击穿导通,将电压钳位在8.8V以内,避免被保护器件过压损坏;
  3. 脉冲防护能力:峰值脉冲电流(Ipp)=22.7A,峰值脉冲功率(Ppp)=200W——可承受高强度瞬态脉冲(如IEC 61000-4-2接触放电8kV、空气放电15kV,IEC 61000-4-4快速脉冲群);
  4. 反向漏电流:Ir=500μA——低漏电流设计,不额外增加系统功耗,适配低功耗设备需求;
  5. 工作温度范围:-55℃~+150℃——宽温耐受能力,可在极端环境(如汽车发动机舱、工业户外设备)稳定工作。

三、封装与可靠性设计

SMF3.3A采用SOD-123FL小型表面贴装封装,具备以下设计优势:

  • 小型化适配:封装尺寸紧凑(符合0805封装尺寸规范),适合高密度PCB布局,满足消费电子、通信设备的小型化需求;
  • 焊接可靠性:支持回流焊、波峰焊等标准表面贴装工艺,焊接过程无封装损坏风险;
  • 抗应力能力:封装结构优化,可承受机械振动、冲击,适配汽车、工业等振动环境应用。

四、符合标准与认证

SMF3.3A的防护性能完全符合国际电磁兼容(EMC)标准:

  • IEC 61000-4-2:静电放电(ESD)防护标准,满足接触放电8kV、空气放电15kV的防护要求;
  • IEC 61000-4-4:快速瞬变/脉冲群(EFT)防护标准,可有效抑制工业环境中的脉冲干扰。

上述标准覆盖了电子设备常见的瞬态干扰场景,确保产品在不同应用中均能提供可靠防护。

五、典型应用电路参考

SMF3.3A的单路防护设计,典型应用电路如下:

  • 接口端口防护:将TVS并联在被保护端口(如USB、CAN总线)与地之间,当端口出现瞬态过压时,TVS快速导通,将过压脉冲泄放到地,保护后端IC;
  • 电源线路防护:并联在3.3V电源输出端与地之间,抑制电源线上的瞬态浪涌,避免电源过压损坏负载器件。

总结

SMF3.3A凭借小型化封装、宽温耐受、高脉冲防护能力、低漏电流等核心优势,成为3.3V系统瞬态过压防护的理想选择,广泛适配消费电子、工业控制、汽车电子、通信设备等多领域应用,可有效提升电子设备的可靠性与抗干扰能力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.