WMSIC Electronic Components

ElecSuper T2N7002BK-ES T2N7002BK

ModelT2N7002BK-ES
PackageSOT-23
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super T2N7002BK-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
T2N7002BK-ES
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.021g
Electronic Component
1
Electronic Component
BM0264576368
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T2N7002BK-ES 产品概述

一、产品简介

T2N7002BK-ES 是由 ElecSuper(静芯微)推出的一款小功率 N 沟道增强型场效应管(MOSFET),采用 SOT-23 封装,面向低电压控制、低功耗和小信号开关应用。器件额定漏源电压为 60V、连续漏极电流 300mA,适合移动设备、传感器接口、逻辑级电平转换以及小功率开关场合。

二、主要参数

  • 类型:N 沟道 MOSFET(增强型)
  • 数量:1 个 N 沟道
  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:300mA
  • 导通电阻 RDS(on):1.85Ω @ Vgs = 10V;2.05Ω @ Vgs = 4.5V
  • 阈值电压 Vgs(th):1.6V(典型)
  • 耗散功率 Pd:350mW(SOT-23 封装,需按 PCB 热阻注意功率分配)
  • 栅极电荷 Qg:1.8nC @ Vgs = 4.5V
  • 输入电容 Ciss:28pF
  • 输出电容 Coss:11pF
  • 反向传输电容 Crss(Miller):4pF
  • 工作温度:-55℃ ~ +150℃
  • 封装:SOT-23

三、关键特性与优势

  • 宽电压余量:60V 的 Vdss 为中高压小信号开关提供了良好的耐压裕量,可用于较高电压的电源管理或工业接口。
  • 逻辑电平可驱动:在 4.5V 栅压下 RDS(on) = 2.05Ω,配合单片机或逻辑电平驱动电路可直接驱动小负载。
  • 低门极电荷:Qg = 1.8nC(4.5V)使得门极驱动功率低,切换时对驱动器负担小,有利于低功耗系统。
  • 小封装、高集成度:SOT-23 封装便于在空间受限的电路板上布置,适合批量自动贴装生产。
  • 宽温度范围:支持 -55℃ 至 +150℃ 的工作环境,适用于要求一定温度可靠性的传统与工业场合。

四、典型应用场景

  • 电平移位与逻辑接口(单片机/外设间的小电流开关)。
  • 低功耗开关:驱动小型继电器线圈、指示灯、蜂鸣器或小功率传感器。
  • 信号开关与复用:高速或中速数字信号的断接/传递(注意 Miller 效应和负载条件)。
  • 逆极性保护与反向电流控制(配合外部电路)。
  • 便携设备与电池管理中的局部开关、断电控制等。

五、使用建议与注意事项

  • 热设计:器件 Pd 仅 350mW,SOT-23 封装的热阻较大。在高环境温度或持续高电流场合需进行 PCB 铜箔散热、减小占空比或选择并联/更大封装器件以避免过热。
  • 栅极驱动与开关速度:基于 Qg = 1.8nC,可估算门极驱动电流需求(例如要在 100ns 切换,则 Ig ≈ 18mA)。考虑到 Ciss、Crss 的影响,快速切换时可能出现过渡损耗和振铃,建议适当串联门极电阻以抑制振荡并控制切换过渡。
  • Miller 效应:Crss = 4pF,开关过程中会产生 Miller 电荷,尤其在压降较大或存在快速边沿时需关注栅极-漏极耦合导致的误导通或延迟。
  • 测试条件与实际表现:RDS(on) 标称在特定 Vgs 下测得,实际电路中受温度、散热与电流密度影响,应在目标工作点验证功耗与温升。
  • ESD 与静电防护:SOT-23 器件对静电敏感,建议储存、贴装和测试时做好 ESD 保护。

六、封装与可靠性

T2N7002BK-ES 采用工业常见的 SOT-23 小封装,适合自动贴片生产流程。材料与工艺满足一般电子产品的可靠性要求,工作温度达到 -55℃ 到 +150℃,可用于要求温度泛化的消费与工业应用场合。为延长使用寿命,建议在设计中考虑热应力与电气过载保护。

总结:T2N7002BK-ES 是一颗面向小功率开关与逻辑接口的通用型 N 沟道 MOSFET,结合 60V 耐压、低门极电荷与 SOT-23 小型封装,适合空间受限、功耗敏感的电子应用。在具体设计中请根据实际工作电流、环境温度和开关频率做好热管理与门极驱动匹配。

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