WMSIC Electronic Components

ElecSuper NDS331N-ES NDS331N

ModelNDS331N-ES
PackageSOT-23
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super NDS331N-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
NDS331N-ES
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0257395291
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V
Capacitor(Ciss)
470pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NDS331N-ES — ElecSuper(静芯微)N沟道场效应管产品概述

一、产品简介

NDS331N-ES为ElecSuper(静芯微)推出的一款低压小封装N沟道增强型MOSFET,SOT-23封装,适合空间受限且需低导通损耗的开关与功率管理场合。额定漏源耐压20V,连续漏极电流4A,适用于5V及更低电压系统的高效开关应用。

二、主要电气参数

  • 漏源耐压(Vdss):20V
  • 连续漏极电流(Id):4A
  • 导通电阻(RDS(on)):25mΩ @ Vgs=4.5V;29mΩ @ Vgs=2.5V
  • 最大耗散功率(Pd):1.2W(SOT-23热性能限制)
  • 阈值电压(Vgs(th)):0.75V @ ID=250µA
  • 总栅极电荷(Qg):6nC @ Vgs=4.5V
  • 输入/输出/反向传输电容:Ciss=470pF、Coss=55pF、Crss=50pF

三、主要特性

  • 低RDS(on)降低导通损耗,有利于提高效率与降低发热。
  • 适中栅极电荷(6nC)在驱动能耗与开关速度间取得平衡,兼容大多数MCU直驱或小功率驱动器。
  • SOT-23小封装便于表贴,适合便携、消费电子与通信终端等空间受限设计。

四、典型应用场景

  • 电源开关与负载断路(低压DC-DC前端、背光/电机驱动)
  • 热插拔/负载开关与电流限流电路
  • 电池管理系统与充电控制(5V或更低电压域)
  • 通信/消费类便携设备的电源路径控制

五、封装与热管理

SOT-23小封装热阻较大,器件Pd受PCB散热影响显著。推荐在PCB上设计较大铜箔散热区(连接源/漏电极的热铺铜),并在布局上尽量缩短功率回路的走线以降低寄生电阻与温升。

六、使用建议与注意事项

  • 驱动电压选择:若要求最低导通电阻,建议采用4.5V栅压;若仅由2.5V驱动,应注意RDS(on)略有上升。
  • 开关设计:根据Crss、Ciss特点优化驱动器与阻尼,以避免振铃与过度EMI。
  • 焊接与储存:遵循SMD焊接工艺与静电防护规范,避免高温快速热冲击与静电损伤。

七、总结

NDS331N-ES以其低导通阻抗、适中栅极电荷和小型SOT-23封装,适合5V以下系统的高效开关与电源路径控制。结合良好的PCB散热设计,可在便携与通信类产品中实现可靠的功率管理表现。

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