WMSIC Electronic Components

ElecSuper BSS138PW

ModelBSS138PW
PackageSOT-323
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super BSS138PW
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
BSS138PW
Electronic Component
1
Package
SOT-323
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0258806367
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
236mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS138PW 产品概述

一、产品简介

BSS138PW 是一款小功率 N 沟道增强型场效应管,封装为 SOT-323(超小型封装),由 ElecSuper(静芯微)提供。器件针对空间受限和低功耗应用优化,适合开关、信号电平转换与负载控制等场景。器件工作温度范围为 -55℃ 到 +150℃,适应较宽的工业温度要求。

二、主要电气参数

  • 类型:N 沟道 MOSFET(增强型)
  • 漏源电压 Vdss:60V(注:产品描述处亦有 50V 标注,请以实际产品铭牌或厂商数据手册为准)
  • 连续漏极电流 Id:约 360mA(典型应用可见 300mA 到 360mA 范围)
  • 最大耗散功率 Pd:约 236mW(描述中亦见 300mW 标称)
  • 导通电阻 RDS(on):1.5Ω @ Vgs=10V
  • 阈值电压 Vgs(th):约 1.0V @ Id=250µA
  • 门极总电荷 Qg:约 650pC @ Vgs=4.5V
  • 输入电容 Ciss:25pF;输出电容 Coss:9.7pF;反向传输电容 Crss:2.2pF

三、特性与优势

  • 超小封装(SOT-323)便于高密度 PCB 布局,适合消费电子与便携设备。
  • 较高的 Vdss(50–60V 等级)使器件能在较大电压裕量下工作,适用于隔离式或高侧保护应用。
  • 较低的 Ciss/Coss 有利于高速开关性能,门极充放电速度更快,尽管 Qg 相对偏大,需关注驱动能力。
  • 阈值电压低,可在较低栅压下进入导通,但完全导通时仍依赖足够栅压以降低 RDS(on)。

四、典型应用场景

  • 低电流开关与电源路径断开(电池管理、电源选择)
  • 电平移位与逻辑接口保护(尤其需要耐压的电平转换)
  • 便携式设备、传感器节点、MCU 外围电源控制
  • 小功率 PWM 与脉冲开关场合(需注意耗散与散热)

五、设计与使用建议

  • 考虑到 RDS(on) 在 Vgs=10V 下仍为 1.5Ω,若需要更低导通损耗,应确保栅极驱动到足够电压或选用更低 RDS(on) 器件。
  • Qg 值较大,短脉冲或高速切换时门极驱动器需提供相应电流;若驱动能力有限,会增加开关损耗与开关时间。
  • 封装热阻较高,应注意功耗限制与 PCB 散热设计,避免长期在额定 Pd 附近工作。
  • 在高压或关键电路中,建议参考厂商完整数据手册并进行实际温升与耐压测试。

六、选型与替代

选择时以实际工况(最大电流、开关频率、可用栅压与散热条件)为准。若要求更低 RDS(on) 或更大电流,应考虑体积稍大但导通损耗更低的替代品;若空间极为受限且工作电流更小,BSS138PW 的小型化与耐压能力仍是优势。

如需完整参数、封装图与典型应用电路,请参阅厂商数据手册或联系 ElecSuper 技术支持以获取详尽资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.