WMSIC Electronic Components

ElecSuper ESD73034D-ES ESD73034D

ModelESD73034D-ES
PackageDFN2510
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super ESD73034D-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
ESD73034D-ES
Electronic Component
1
Package
DFN2510
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.034g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.2pF
Electronic Component
BM0229472059
Operating Temperature
40℃~+125℃
Voltage
7V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD73034D-ES 产品概述

一、产品简介

ESD73034D-ES 是 ElecSuper(静芯微)推出的一款四通道双向瞬态过电压保护器件,封装为 DFN2510,专为 3.3V 系统和高速数据接口提供高可靠性的静电放电(ESD)及脉冲浪涌保护。器件工作温度范围宽(-40℃ 至 +125℃),符合 IEC 61000-4-2、IEC 61000-4-4 和 IEC 61000-4-5 等工业级防护标准,适合严苛电磁环境下使用。

二、主要特性

  • 极性:双向,适用于信号双向传输线保护。
  • 反向截止电压 Vrwm:3.3V,针对 3.3V 逻辑/接口优化。
  • 钳位电压:约 7V;在更高能量条件下可达到 13V(受测试条件影响)。
  • 峰值脉冲电流 Ipp:8A(8/20μs,单次波形)。
  • 峰值脉冲功率 Ppp:120W(8/20μs)。
  • 击穿电压:4V(典型,表征导通门槛)。
  • 反向电流 Ir:≤1μA(低漏电,利于节能及高阻抗电路)。
  • 结电容 Cj:0.6pF(低电容设计,极大降低对高速信号的影响)。
  • 通道数:4 路,适合多路接口并行保护。

三、电气性能与保护能力

ESD73034D-ES 在标准 8/20μs 波形下能承受高达 8A 的脉冲电流并吸收 120W 峰值功率,能够有效缓解常见的人体静电放电(HBM/IEC 61000-4-2)、电快速瞬变(EFT/IEC 61000-4-4)以及感应/直击雷等导致的浪涌(IEC 61000-4-5)。低结电容(0.6pF)使其对高速数据线(如 USB、MIPI、LVDS 等)几乎无感,能在不损害信号完整性的前提下提供保护。器件双向结构适合双向传输或未区分方向的信号线。

四、典型应用场景

  • 手机、平板等移动终端的外部接口(USB、耳机、数据接口)。
  • 摄像头模组、显示接口(MIPI/DSI、LVDS)的引脚保护。
  • 工业控制及通信设备的 I/O 端口和传感器接口。
  • 网络设备与消费电子产品中要求低电容且多通道保护的场合。

五、PCB 布局与使用建议

  • 将器件放置在受保护信号线靠近连接器的一侧,尽量缩短信号线到器件的回路。
  • 保护地(GND)应采用低阻抗回流路径,多通过孔靠近接地平面以提高放电能力。
  • 对高速差分线,注意保持差分间距和阻抗一致,避免在保护器件附近引入不必要的串扰。
  • 在高能脉冲环境下,必要时配合串联阻抗或共模滤波器以分担能量并降低钳位电压冲击。

六、封装与可靠性

ESD73034D-ES 采用 DFN2510 小型封装,适合空间受限的移动设备与消费电子主板布置。器件通过工业级温度与多项 IEC 标准认证,工作温度范围 -40℃ 到 +125℃,可靠性适合长期部署在复杂电磁环境下的产品。

产品型号:ESD73034D-ES(品牌:ElecSuper / 静芯微)。如需更多技术资料(如典型钳位曲线、封装引脚图、可靠性测试报告或参考电路),可联系供应商获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.