WMSIC Electronic Components

ElecSuper BC091N-H(ES) BC091N

ModelBC091N-H(ES)
PackageSMD,4.3x3.2mm
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super BC091N-H(ES)
Type
ELECSUPER
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
BC091N-H(ES)
Electronic Component
1
Electronic Component
3.2mm
Package
SMD,4.3x3.2mm
Electronic Component
(GDT)
Electronic Component
±30%
Electronic Component
0.645g
Electronic Component
4.5mm
Electronic Component
2.7mm
Electronic Component
1
Electronic Component
BM0258772442
Capacitor
0.5pF
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC091N-H(ES) 产品概述

一、产品简介

BC091N-H(ES) 是静芯微(ElecSuper)出品的一款表面贴装型瞬态过电压防护器件,定位于为敏感电子线路提供浪涌能量吸收和放电保护。器件具有较低的极间电容(约0.5 pF),适合对高速信号影响敏感的场合;同时具备较高的脉冲放电能力,可承受短时大电流冲击,提升系统在雷击或开关冲击下的可靠性。

二、主要特性

  • 直流击穿电压(Vdc):90 V(标称),允许范围±30%;
  • 冲击击穿电压(Vimp):600 V;
  • 脉冲放电电流:2 kA(峰值);
  • 极间电容:约 0.5 pF,适合高速/高频线路;
  • 封装形式:SMD,标称尺寸 4.3×3.2 mm;
  • 器件尺寸(典型):长 4.5 mm × 宽 3.2 mm × 高 2.7 mm。

三、典型电气参数(概览)

  • 工作静态电压:约 90 V(±30%)——用于判断在正常工作条件下器件不自触发的电压等级;
  • 脉冲放电承受能力:2 kA(单次冲击能力,具体波形与次数应参照厂方测试标准);
  • 极间电容:0.5 pF(对高速信号串扰和带宽影响极小);
  • 冲击耐受:600 V(短时冲击击穿门限)。

注:以上参数为主要参考值,设计时应以厂方最新版数据手册为准,并考虑器件公差与环境影响。

四、封装与机械特性

BC091N-H(ES) 采用 SMD 封装,标称外形 4.3×3.2 mm,器件本体典型高度 2.7 mm,长度方向常见为 4.5 mm(含工艺允许差)。小尺寸便于在受限空间内实现防护布局,适合自动贴装与回流焊工艺。

五、典型应用场景

  • 通信端口与接口保护(如基站、光模块保护的输入端);
  • 电源线、车载线路、太阳能逆变器等直流系统的浪涌防护;
  • 工业控制设备、仪表与测量设备中的过压防护;
  • 需要兼顾高速信号完整性与抗浪涌能力的应用场合。

六、使用建议与注意事项

  • 器件直流击穿电压公差较大(±30%),电路设计时应留有余量,避免在接近下限或上限工作点长期受应力;
  • 对于重复浪涌、脉冲次数受限的场合,应结合系统能量吸收路径(串联阻抗、熔断器或防护器件阵列)进行整体设计;
  • 极间电容小,适合高速信号线路,但仍应注意布局靠近受保护端以降低寄生电感;
  • 推荐遵循厂方的回流焊与温度曲线,避免超过推荐焊接温度导致性能退化;
  • 在关键应用中建议进行实际浪涌试验验证(按 IEC/ITU 等标准)以确认系统级保护效果。

七、可靠性与储运

器件适合常规电子元件储存与运输条件,避免潮湿、剧烈振动和强腐蚀性气氛。为确保焊接可靠性,若器件采用吸湿袋包装,应根据其等级进行相应回潮处理(烘烤)后贴装。

总结:BC091N-H(ES) 以其高脉冲放电能力(2 kA)、低极间电容(0.5 pF)和小尺寸封装,适用于要求高速信号兼顾浪涌保护的场合。实际选型应结合系统工作电压、冲击能量评估及厂方详细规格书进行最终确认。

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