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ElecSuper PESD3V3L1BA-ES PESD3V3L1BA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Elec Super PESD3V3L1BA-ES
- Type
- ELECSUPER
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ELECSUPER
- Electronic Component
- PESD3V3L1BA-ES
- Electronic Component
- 1
- Package
- SOD323
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.025g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 46pF
- Electronic Component
- BM0264576553
- Voltage
- 15V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 1uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD3V3L1BA-ES 产品概述
一、概述
PESD3V3L1BA-ES 是 ElecSuper（静芯微）推出的一款高可靠性单路双向 ESD 静电保护器件，专为 3.3V 信号线设计。器件采用 SOD323 小体积封装，具备快速响应、低钳位电压和较小结电容特性，适用于音频、视频、通信接口以及各种高频信号链路的防护需求。
二、主要参数
- 极性：双向（Bi-directional）
- 工作反向截止电压 VRWM：3.3 V
- 击穿电压 VBR：3.5 V（典型）
- 钳位电压 Vc（Ipp 条件）：15 V（典型）
- 峰值脉冲电流 Ipp：30 A
- 峰值脉冲功率 Ppp：250 W（单次脉冲）
- 反向漏电流 Ir：≤1 µA
- 结电容 Cj：约 45 pF（典型）/ 46 pF（最大）
- 通道数：单路
- 防护等级：符合 IEC 61000-4-2（支持最高 30 kV 空气放电等级）
- 封装：SOD323
三、关键特性与优势
- 小体积高能量吸收：SOD323 封装下实现 30A 峰值脉冲电流和 250W 峰值功率，适合空间受限的移动与消费类电子。
- 低结电容：约 45 pF 的结电容在保证防护的同时，最大限度降低对高速信号完整性的影响，适用于音视频及高速通信接口。
- 快速钳位响应：典型钳位电压 15V，可在 ESD 或瞬态冲击时有效钳制电压，保护下游芯片免于过压破坏。
- 双向结构：无需方向识别，适合双向数据线和差分信号保护。
四、典型应用
- 智能手机、平板的耳机、麦克风、按键等音频接口防护
- 视频接口（如摄像头数据线）以及通用串行接口的瞬态保护
- 无线模块、蓝牙、Wi‑Fi 天线入口及通信端口的 ESD 防护
- 工业与消费电子中对抗静电冲击的关键信号线保护
五、封装与 PCB 布局建议
- 将器件尽量靠近被保护接口布置，焊盘走线短且粗，减小寄生感抗。
- 在器件与敏感芯片间避免长走线或环路，必要时添加接地回流路径。
- 对高速差分线保持对称布局，器件结电容对频率响应有影响，应在系统级评估信号完整性。
六、可靠性与合规
PESD3V3L1BA-ES 满足 IEC 61000-4-2 ESD 等级要求，可承受高达 30 kV 空气放电（具体应用中建议按实际测试验证）。低漏电流和稳定的钳位特性保证长期可靠性，适合量产部署。
七、选型与注意事项
- 若目标系统对信号带宽极高且对电容敏感，需在实际频率下验证 Cj 对信号的影响；必要时选用更低容抗的保护器件。
- 对于需承受更大脉冲能量或多路保护场景，可并联或采用多通道器件，但应注意热耗散和等效阻抗匹配。
- 建议在样机阶段进行完整的系统级 ESD 与传导发射（EMC）测试，确保器件在实际工作条件下满足防护需求。
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