WMSIC Electronic Components

ElecSuper NCE6020AK-ES NCE6020AK

ModelNCE6020AK-ES
PackageTO-252
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super NCE6020AK-ES
Type
ELECSUPER
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
NCE6020AK-ES
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.463g
Electronic Component
1
Electronic Component
BM0258810076
Power Dissipation(Pd)
25W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V
Capacitor(Ciss)
860pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCE6020AK-ES 产品概述

一、产品简介

NCE6020AK-ES 是由 ElecSuper(静芯微)推出的一颗 60V 级 N 沟道功率 MOSFET,封装为 TO-252(DPAK),面向中小功率开关和驱动应用。器件在不同栅压下具有较低的导通电阻,兼顾导通损耗与开关性能,适合开关电源、同步整流、负载开关与马达驱动等场景。

主要参数一览:

  • 类型:N沟道 MOSFET(1 颗)
  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:20A
  • 导通电阻 RDS(on):26mΩ @ Vgs=10V;33mΩ @ Vgs=4.5V(@10A)
  • 耗散功率 Pd:25W(受散热条件影响)
  • 阈值电压 Vgs(th):1.6V @ 250μA
  • 总栅电荷 Qg:20.3nC @ Vgs=10V
  • 输入电容 Ciss:860pF;反向传输电容 Crss:51pF;输出电容 Coss:62pF
  • 封装:TO-252(DPAK)
  • 品牌:ElecSuper(静芯微)

二、主要特性与优势

  • 低导通电阻:在 10V 驱动下 RDS(on) 可低至 26mΩ,有利于降低导通损耗,适合高效率应用。
  • 兼容逻辑驱动:在 4.5V 驱动下 RDS(on) 为 33mΩ,对于部分 5V/4.5V 逻辑驱动环境仍能保持良好性能。
  • 中等开关速度:Qg≈20.3nC,兼顾驱动能量与开关损耗,便于在中频率开关电源与马达驱动中取得平衡。
  • 紧凑封装:TO-252(DPAK)适合表贴工艺,便于大批量 PCB 封装与散热设计。

三、典型应用场景

  • 开关电源(DC-DC 变换器、降压/升压模块)
  • 同步整流器与次级整流开关
  • MOSFET 半桥或全桥驱动电路
  • 电机驱动(低至中功率直流电机)
  • 负载开关与逆变辅助功率开关

四、设计与使用建议

  • 栅极驱动:为达到标称低 RDS(on),建议在可能的情况下采用 10V 驱动;若系统仅有 4.5V 驱动,可接受但需考虑稍高的导通损耗。
  • 驱动能力:Qg≈20.3nC,快速开关时请确保栅极驱动器能够提供足够的瞬时电流,以控制 dv/dt 并避免过高开关损耗与 EMI。
  • 布局与散热:TO-252 为表贴散热方式,建议使用较宽的铜箔、必要时在导热垫下设多孔过孔通往内层或底层散热层,以降低结壳温升并接近 Pd 指标。
  • 开关损耗优化:注意 Crss(51pF)影响下的死区能量与回灌节点交互,合理选择缓冲网络或门阻以抑制振铃并优化 EMI。

五、可靠性与注意事项

  • 耗散功率 25W 为典型值,实际允许功率受 PCB 散热、环境温度与结温限制,请依据系统热仿真或实测数据确认最大允许电流与功耗。
  • Vgs 超限保护:避免栅源电压超过器件最大额定值(请参阅完整数据手册),在高压脉冲或反向电压情形下应加合适钳位或栅极保护元件。
  • 焊接与封装可靠性:按 TO-252 的回流焊推荐工艺执行,避免长期高温应力导致可靠性下降。

六、选型提示与替代方案

  • 若系统优先低导通损耗且可提供 10V 驱动,NCE6020AK-ES 在 60V/20A 级别具有竞争力。若要求更低的 RDS(on) 或更高电流,应考虑更大尺寸封装或 4 针 TO-220 类封装器件。
  • 若系统仅有 3.3V 驱动,需选择专门的逻辑级 MOSFET(在 2.5–3.3V 下亦能获得低 RDS(on))以保证效率。

如需完整电气特性曲线、最大额定值及热阻等详细参数或样品测试数据,建议参阅厂家提供的正式数据手册或联系 ElecSuper(静芯微)技术支持获取进一步资料。

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