WMSIC Electronic Components

ElecSuper 3R090A-5S(ES) 3R090A

Model3R090A-5S(ES)
PackageSMD,7.6x5mm
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super 3R090A-5S(ES)
Type
ELECSUPER
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
3R090A-5S(ES)
Electronic Component
1
Electronic Component
5mm
Package
SMD,7.6x5mm
Electronic Component
(GDT)
Electronic Component
±20%
Electronic Component
0.959g
Electronic Component
7.6mm
Electronic Component
5mm
Electronic Component
1
Electronic Component
BM0234656027
Capacitor
1.5pF
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3R090A-5S(ES) 产品概述

一、产品简介

3R090A-5S(ES) 是 ElecSuper(静芯微)推出的一款高能量表面贴装型瞬态放电保护器件,适用于需要在有限空间内实现大电流浪涌/冲击保护的应用场合。器件通过优化结构在保证强抗冲击能力的同时,保持极低的极间电容,兼顾保护性能与信号完整性。

二、主要性能特点

  • 直流击穿电压 (Vdc):90V,允许公差 ±20%(典型工作范围约 72V–108V),适用于中高压侧保护。
  • 脉冲放电电流:5kA(峰值),能承受大能量短时冲击,适合雷击、开关冲击等极端脉冲事件的保护。
  • 冲击击穿电压 (Vimp):600V,表明器件在高压瞬态下的击穿耐受能力。
  • 极间电容:1.5pF,极低的寄生电容利于高速信号通道应用,减少信号畸变和带宽损失。
  • 封装及尺寸:SMD,外形 7.6 × 5 × 5 mm,适合自动贴装和中密度布局。
  • 品牌:ElecSuper(静芯微)。

三、典型应用场景

  • 通信与数据接口保护:低极间电容使其可用于对高速串行链路、差分对或敏感模拟通道的保护(需注意额定电压匹配)。
  • 工业电源与控制系统:对中高压直流母线、控制电源及传感器接口提供浪涌防护。
  • 交通与电力设备:用于逆变器、充电桩、照明驱动等易受雷击或开关浪涌影响的系统。
  • 其他需要大脉冲能量处理且空间受限的场合。

四、电气与机械参数要点

  • 击穿与耐压:Vdc 90V(±20%),Vimp 600V,选择时应确保器件的工作电压低于系统稳态电压并高于可能出现的瞬态正常值。
  • 能量处理:5kA 脉冲放电能力适合短时大电流冲击,但不代表能连续承受,请按脉冲能量谱和重复率合理选型与布局。
  • 极间电容:1.5pF 提升对高速信号的兼容性,但对于极低噪声模拟路径仍建议进行评估。
  • 尺寸与封装:7.6×5mm SMD 芯片,厚度 5mm,适配常规回流焊工艺,封装标识请参考厂商资料。

五、设计与使用建议

  • 布局:保护元件应尽可能靠近被保护端口或连接器,缩短信号及回流环路,降低串扰与寄生感抗。
  • 热管理与散热:在高能量冲击场景下,保证焊盘和周边铜箔有足够散热面积,有条件时可在PCB背面增加过孔散热。
  • 配合元件:在需要时与串联限流电阻、滤波器或其他浪涌抑制器件配合使用,以优化响应与重复承受能力。
  • 测试验证:在最终产品中进行实际环境的浪涌/ESD测试,验证稳态工作与保护触发电压范围符合系统需求。

六、可靠性与封装信息

该器件采用符合表贴工艺的封装,适合标准回流焊流程。建议遵循厂商的存储、贴装及焊接温度曲线,避免高温长时间回流或机械应力导致封装损伤。产品可靠性指标和寿命应以厂方提供的规格书与加速老化试验数据为准。

总结:3R090A-5S(ES) 提供了高脉冲放电能力与低极间电容的平衡方案,适合在对浪涌能量要求高且对信号完整性敏感的系统中作为关键防护元件选型。选用时请结合具体工作电压、冲击能量谱与系统布局进行验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.