WMSIC Electronic Components

ElecSuper BSS123-7-F BSS123

ModelBSS123-7-F
PackageSOT-23
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super BSS123-7-F
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
BSS123-7-F
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0230855541
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS123-7-F 产品概述

一、概述

BSS123-7-F 是静芯微(ElecSuper)推出的一款小功率、高压逻辑电平 N 沟道场效应管,封装为常用的 SOT-23。器件工作温度范围宽 (-55℃ 到 +150℃),适合在工业级和商业级电子产品中作为开关或信号控制元件使用。其设计兼顾了耐压性、开通电阻与开关性能,适合对体积与成本敏感的应用场景。

二、主要参数

  • 类型:N 沟道 MOSFET
  • 漏源耐压 Vdss:100 V
  • 导通电阻 RDS(on):2.7 Ω @ VGS = 10 V
  • 阈值电压 Vgs(th):1.8 V @ ID = 250 μA
  • 连续漏极电流 ID:290 mA
  • 功耗 Pd:350 mW
  • 输入电容 Ciss:29 pF
  • 输出电容 Coss:2.8 pF
  • 反向传输电容 Crss:2 pF
  • 封装:SOT-23
  • 工作温度:-55℃ ~ +150℃
  • 数量:单颗(1个 N 沟道)

三、关键特性与电气意义

  • 高耐压(100V):适合中低功率、高电压场合,例如小电流开关、HV 信号控制或保护电路。
  • 低到中等导通电阻(2.7Ω @10V):在 VGS 充分驱动时,导通损耗可接受。举例:在最大额定连续电流 290 mA 下,理论导通损耗 I^2·R≈0.29^2×2.7≈226 mW,仍在器件 Pd 范围内,但需考虑封装散热限制。
  • 门极阈值 ~1.8V:对低压逻辑电平有一定响应,但 RDS(on) 标定在 10V,若仅以 3.3V 或 5V 驱动,实际导通电阻会显著上升,应在设计时验证实际导通损耗。
  • 小电容(Ciss 29 pF,Crss 2 pF):开关时栅极和米勒电容较小,有利于快速切换与降低驱动能量,适合高速信号和脉冲应用。

四、典型应用场景

  • 小电流高压开关:太阳能监控电路、传感器高压侧断电。
  • 保护与隔离电路:反向保护、低频 MOSFET 阵列中的控制元件。
  • 模拟/数字混合电路中的低功耗开关与电平转换(需注意驱动电压)。
  • 工业控制与家电小功率驱动场合。

五、封装与热管理建议

SOT-23 为小封装,散热能力有限。尽管 Pd 标称 350 mW,实际应用中应:

  • 避免长时间在接近 Pd 的条件下工作;考虑热阻与 PCB 铜面积。
  • 在 PCB 上为器件的散热焊盘加大铜箔面积或连接到散热层。
  • 评估工作环境温度与器件结温,确保在极端工况下仍有足够余量。

六、PCB 布局与驱动建议

  • Gate:尽量缩短门极走线并避免与敏感模拟线平行,必要时并联小电阻抑制振荡。
  • Drain/Source:为降低导通损耗与热量集中,尽量扩大相应焊盘的铜箔面积。
  • 由于 Crss 小,米勒效应影响较小,但在快速切换或大电压摆幅时仍需适当驱动能力以避免过渡损耗。

七、选型要点与注意事项

  • 若系统以 10V 以上门极驱动,器件能达到标注 RDS(on);在 3.3–5V 驱动下需做电阻测评。
  • 连续电流与功耗受封装热性能限制,应结合 PCB 散热设计确认实际允许电流。
  • 小电容利于高速切换,但若用于高频大电流场合并非最佳选择。
  • 购买与替换时注意品牌(ElecSuper/静芯微)与封装一致性,避免型号混淆。

总体而言,BSS123-7-F 适合体积受限且需中等耐压的小功率开关场合。合理的驱动电压和良好的 PCB 散热设计能发挥其性能优势。

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