Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ElecSuper WS03DLC-B-ES WS03DLC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Elec Super WS03DLC-B-ES
- Type
- ELECSUPER
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ELECSUPER
- Electronic Component
- WS03DLC-B-ES
- Electronic Component
- 1
- Package
- SOD323
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 1.2pF
- Electronic Component
- BM0258806409
- Voltage
- 20V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 1uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WS03DLC-B-ES 产品概述
一 产品简介
WS03DLC-B-ES 是静芯微（ElecSuper）推出的一款高性能双向瞬态抑制二极管（TVS），面向3.3V工作电压等级的低压敏感信号线防护。器件采用小型 SOD323 封装，单通道设计，专为需抗静电和浪涌冲击但对通道电容敏感的高速数据或控制接口提供可靠保护。
二 主要特性
- 极性：双向（bidirectional），无需区分正负方向，适用于交流或双向信号线。
- 反向截止电压 Vrwm：3.3V（适配3.3V电源与I/O）。
- 击穿电压：3.5V（典型）。
- 钳位电压：20V（峰值钳位能力，保护设备免受高压冲击）。
- 峰值脉冲电流 Ipp：15A（一次脉冲承受能力）。
- 峰值脉冲功率 Ppp：180W（典型测试条件下的瞬时功率吸收能力，详见型号规格书）。
- 反向漏电流 Ir：1 μA（在 Vrwm 下的低漏电流，利于低功耗应用）。
- 结电容 Cj：约 1.2 pF（低电容，适合高速信号线），单通道设计。
- 防护等级：满足 IEC 61000-4-2 静电放电保护规范。
- 封装：SOD323（表面贴装，体积小，利于高密度 PCB 布局）。
三 典型应用场景
- 3.3V 电平的 UART、SPI、I2C、GPIO、SD 卡、蓝牙/Wi‑Fi 模块接口防护。
- 移动设备和可穿戴产品的信号线与接口防护。
- 工业控制、仪器仪表中对静电敏感的通信与控制线路。
- 需要低结电容以维持信号完整性的高速数据通道防护设计。
四 PCB 布局与使用建议
- 建议将器件尽量靠近被保护引脚布置，最短走线到地，以减小环路电感和提升抑制效果。
- 双向型号无需方向区分，按两端分别连接至被保护线；另一端接系统地或参考地。
- 对于高速差分对，应注意匹配路径长度与阻抗，并优先选择低电容 TVS（Cj≈1.2 pF）以减少信号衰减。
- SOD323 为常见回流焊兼容封装，请按器件规格书推荐的回流焊温度曲线进行焊接。
五 可靠性与注意事项
- 峰值功率 180W 为瞬态脉冲能力，具体测试波形和时长请参见器件完整规格书；长期或重复冲击下应进行热和能量裕量评估。
- 在使用中应确保器件的最大瞬态能量不被长期超越，避免由于多次大能量冲击导致器件退化。
- 存储与运输时注意防潮，按 EIA/JEDEC 的湿敏等级要求处理，避免焊接期间产生缺陷。
六 型号与采购信息
- 型号：WS03DLC-B-ES
- 品牌：ElecSuper（静芯微）
- 封装：SOD323，单路双向 TVS
- 若需样品、规格书（Datasheet）或可靠性测试报告，请联系供应商或代理商获取完整参数与测试条件，以便在具体应用中进行验证与设计匹配。
如需我为您的具体电路（例如某款 MCU 接口或差分信号线）提供落地保护电路示意或仿真建议，可提供电路原理与使用场景，我将给出更针对性的布局与选型建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
