WMSIC Electronic Components

ElecSuper WNM2021-3/TR-ES WNM2021

ModelWNM2021-3/TR-ES
PackageSOT-323
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super WNM2021-3 / TR-ES
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
WNM2021-3/TR-ES
Electronic Component
1
Package
SOT-323
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0230063720
Power Dissipation(Pd)
600mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V
Capacitor(Ciss)
60pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WNM2021-3/TR-ES 产品概述

一、产品概述

WNM2021-3/TR-ES 是静芯微(ElecSuper)推出的一款低压小功率N沟增强型MOSFET,额定漏源电压20V,适合便携设备及低压电源管理场合的功率开关与保护用途。器件采用SOT-323超小封装,结合低栅极电荷与中等导通电阻,使其在体积受限、功耗要求严格的应用中具有良好性价比。

二、主要特性

  • 类型:N沟道增强型 MOSFET(小信号/功率开关)
  • 最大漏源电压:20V(Vdss)
  • 导通电阻(典型/典型测试条件):180mΩ @ VGS=4.5V;230mΩ @ VGS=2.5V(厂家测试中也可见155mΩ@4.5V于500mA条件下的典型值)
  • 连续漏极电流:800mA(额定值)
  • 峰值/示例条件:描述中给出500mA/900mA相关测试参考,应按实际散热与PCB条件评估
  • 耗散功率:600mW(Pd)
  • 阈值电压:VGS(th)=650mV @ ID=250µA
  • 栅极电荷:Qg ≈ 1nC @ VGS=4.5V(低栅驱动能量需求)
  • 电容:Ciss≈60pF,Coss≈22pF,Crss≈12pF
  • 封装:SOT-323(超小型表贴)

三、电气性能要点

  • 逻辑电平兼容:在2.5V栅压下能导通(RDS(on)≈230mΩ),4.5V下导通更好(≈180mΩ),适合直接由单节锂电或低压MCU驱动。
  • 低栅极电荷(1nC)意味着开关损耗和驱动能耗较小,适合频率不很高的开关场合(例如电源管理开/关、低频PWM)。
  • 低寄生电容(Coss/Crss)有利于开关过渡过程,减小 Miller 效应,便于快速切换。

四、典型应用与参考电路

  • 电池供电设备的负载开关、负载隔离与软启动。
  • 直流-直流转换器中的低侧开关或同步整流(需评估RDS(on)和热能力)。
  • 充电管理、USB电源选择切换、反向电流保护(配合合适外围电路)。
    参考电路要点:低侧开关采用共源接法;高侧应用需配合升压驱动或使用栅极电平转换。建议在栅极串联10–100Ω限流电阻、并接100k下拉防止浮动;必要时在漏端并联RC缓冲或TVS进行浪涌保护。

五、封装与热管理

SOT-323为超小封装,热阻较大,器件的耗散功率(600mW)及持续电流应基于PCB铜箔散热能力评估。布局建议:

  • 在MOSFET底部与漏脚周围使用较大铜面积或热泄露过孔以提高散热;
  • 缩短电源回路走线,减少阻抗和发热集中;
  • 当工作电流接近额定值时,注意测量结温并留有安全余量。

六、使用注意事项与订购信息

  • 推荐在实际应用中对RDS(on)、结温和功率损耗做预实验,特别是在高频或脉冲大电流场合。
  • 避免门极长期承受超过极限电压,注意ESD与浪涌保护。
  • 型号与来源:WNM2021-3/TR-ES,品牌:ElecSuper(静芯微),封装:SOT-323。订购时请注明完整型号与封装批次以确保一致性。

本产品适合追求体积小、驱动功耗低且工作电压≤20V的中低功率开关场合。若需更详细的电气特性曲线、推荐PCB模板或可靠性测试报告,可提供进一步资料以便设计验证。

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