WMSIC Electronic Components

RX8025T-UC RX8025T

ModelRX8025T-UC
PackageSOP-14-208mil
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON RX8025T-UC
Type
EPSON
Minimum package
1000

Technical parameters

Electronic Component
EPSON
Electronic Component
RX8025T-UC
Electronic Component
1
Package
SOP-14-208mil
Electronic Component
Real-Time Clock (RTC)
Electronic Component
0.672g
Electronic Component
1
Features
Programmable Clock Output; Output
Electronic Component
BM0248882121
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Interface Type
I2C
Crystal Oscillator Type
Built-in
Output
Electronic Component
Static Current(Iq)
0.8uA
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RX8025T-UC 产品概述

一、概述

RX8025T-UC 是爱普生(EPSON)推出的一款低功耗实时时钟(RTC)芯片,采用 SOP-14(208 mil)封装,尺寸约 10.1 × 5 mm。该器件集成晶振,无需外部晶体元件即可实现高稳定性时钟振荡。器件通过 I2C 总线与主控通信,并提供闹钟输出,用于系统定时中断或唤醒。其工作电压范围宽(1.8 V 至 5.5 V),静态电流仅 0.8 μA,工作温度覆盖工业级(-40 ℃ 至 +85 ℃),适合低功耗、长期走时及工业环境应用。

二、主要规格

  • 接口类型:I2C(双线总线,SCL / SDA)
  • 工作电压:1.8 V ~ 5.5 V
  • 晶振:内置(无需外接晶体)
  • 闹钟输出:有(用于中断/唤醒)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 静态电流(Iq):0.8 μA(典型,具体以规格书为准)
  • 封装:SOP-14(208 mil),尺寸约 10.1 × 5.0 mm
  • 品牌:EPSON(爱普生)

三、功能特性

  • 完整日历功能:秒、分、时、日、周、月、年(含闰年处理),支持 24/12 小时制切换。
  • 内置晶振:节省外部器件空间与布局复杂度,提高设计可靠性与抗干扰能力。
  • 低功耗:待机静态电流仅 0.8 μA,适合电池供电的长期应用。
  • 闹钟输出:可配置为定时中断或周期性唤醒,便于 MCU 进入深度省电模式后被唤醒。
  • I2C 总线:标准双线接口,便于与各类微控制器或系统芯片连接,支持多从机通信拓扑。
  • 电源冗余/备份:可与主电源与备用电池(如纽扣电池)配合,保证断电情况下的走时保持(具体接法与电池管理参考应用手册)。

四、优势与设计要点

  • 宽输入电压(1.8 V 至 5.5 V):兼容多种系统电平,无需额外电压转换(但注意 I2C 线电平与主控的一致性)。
  • 内置晶振:减少 BOM 成本与外部布局要求,同时降低因外部晶振选型或布线不当引起的振荡问题。
  • 极低静态电流:在电池供电场景(如便携式设备、数据记录仪、智能表计)中显著延长系统待机寿命。
  • 工业温度等级:适用于广泛环境条件,包括户外设备与工业控制系统。
  • 可靠的闹钟输出:便于实现低功耗唤醒、定时采样或闹钟提醒功能。

设计时的实践建议:

  • I2C 拉升电阻:通常采用 4.7 kΩ ~ 10 kΩ,根据总线电容与通信速率选择合适阻值。
  • 供电与备份电池:设计 VCC 与 VBAT 的切换路径时注意减少漏电与反向电流,必要时使用二极管或专用电源开关方案。
  • 去耦与 EMI:靠近 VCC 引脚布置去耦电容(如 0.1 μF),并保证地线回流路径短且可靠,有助于稳定时钟性能。
  • 电平兼容:若主控 I/O 电压与 RTC 不同,考虑使用 I2C 兼容的电平移位电路或确保拉升电阻接到较低电压侧以避免超压。

五、典型应用

  • 手持与便携式设备(计时、闹钟、日志时间戳)
  • 智能家居与消费电子(定时控制、事件记录)
  • 工业控制与数据记录(长期监测、时序控制)
  • 通信与网络设备(系统时钟、事件日志)
  • 智能电表与仪表(断电保持、定时报表)

六、封装与机械信息

RX8025T-UC 采用 SOP-14(208 mil)塑料封装,外形尺寸约 10.1 × 5.0 mm,适合常规贴片制造与回流焊工艺。该封装兼顾空间占用与焊接可靠性,方便在多板空间布局中使用。具体引脚排列与封装细节请参照官方封装图与焊盘推荐图。

七、使用建议与注意事项

  • 上电初始化:系统上电或复位后,主控应读取并校验 RTC 寄存器,若需可通过 I2C 写入校正时间。
  • 闹钟配置:配置闹钟输出前,确认输出的极性与主控外部中断输入兼容,并在唤醒流程中处理去抖与确认。
  • 维护与校准:如需长期高精度走时,可结合网络时间或外部参考定期校准,或在软件层面按需作温度补偿。
  • 规格验证:在最终产品中进行整机级的温漂、掉电恢复、I2C 干扰容限与低温启动验证,确保在目标工作环境下性能满足要求。

结语:RX8025T-UC 以其内置晶振、极低功耗与宽电压/温度特性,适合需要高可靠性长期走时与低功耗备份的各类电子产品。详细电气参数、寄存器定义与典型应用电路请参考 EPSON 官方数据手册,以确保设计满足所有电气与可靠性要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.