WMSIC Electronic Components

X1A0001210005

ModelX1A0001210005
PackageSMD1610-2P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON X1A0001210005
Type
EPSON
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1A0001210005
Electronic Component
1
Package
SMD1610-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.025g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0227584860
Operating Temperature
40℃~+85℃
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Electronic Component
Electronic Component
Electronic Component
5000
Resistor(ESR)
90kΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X1A0001210005 — EPSON 无源贴片晶振(32.768 kHz)

一、产品概述

X1A0001210005 为 EPSON(爱普生)生产的无源贴片晶体谐振器,标称频率 32.768 kHz,常温频差 ±20 ppm,设计用于精确的低频时钟源(如实时时钟 RTC、低功耗计时与唤醒系统)。封装为 SMD1610-2P(典型尺寸 1.6 × 1.0 mm),工作温度范围 -40℃ 至 +85℃,负载电容 CL = 12.5 pF,等效串联电阻(ESR)约 90 kΩ。该器件适合空间受限且要求高精度、低功耗计时的场合。

二、主要特点

  • 精确低频:标准 32.768 kHz(适配二进制计时分频)
  • 高频率稳定性:常温 ±20 ppm,满足多数消费与工业级 RTC 精度需求
  • 低功耗设计:小尺寸、无源晶体,配合低功耗振荡器可实现极低系统耗电
  • 适配负载电容:CL = 12.5 pF,便于与常见 MCU/RTC 内部振荡电路配合
  • 小型封装:SMD1610-2P,利于高密度 PCB 设计与自动贴装

三、典型应用

  • 实时时钟(RTC)模块
  • 低功耗物联网终端、传感器节点、可穿戴设备
  • 手表与计时器、电表等需长期准确计时的设备
  • MCU/SoC 的低速时钟或唤醒定时器

四、设计与使用建议

  • 负载电容选择:若采用对称电容 C1=C2,则每侧电容可按公式近似取 C ≈ 2×(CL − Cstray)。以 PCB 寄生电容 Cstray 约 2–3 pF 估算,建议使用 18–22 pF(常用 20 pF)两端电容。
  • 布局要点:晶体两端与地的旁路电容应尽量靠近晶体引脚放置,晶体引脚到 MCU/RTC 的走线尽量短且远离高频、强驱动信号线,避免耦合与噪声注入。
  • 驱动电平:该类低频无源晶体需低驱动电平以保证稳定与寿命,建议使用 MCU/RTC 内置的专用反相振荡器或低增益振荡电路,避免外加过强驱动。
  • ESR 考虑:ESR ≈ 90 kΩ 为典型值,选择振荡器时应保证能在该 ESR 下可靠启动;若振荡难以启动,可检查负载电容与外围元件是否匹配。

五、可靠性与焊接

  • 焊接适配回流焊工艺,建议遵循厂商回流温度曲线与峰值温度限制以防内部应力或性能退化。
  • 存储与搬运:避免机械应力与强烈振动,防止封装变形;防潮包装保存,开盘后应按标准回流时间内使用。
  • ESD 防护:虽为被动器件,但仍建议在生产与装配环节采取常规静电防护措施。

六、封装与订购信息

  • 品牌:EPSON(爱普生)
  • 型号:X1A0001210005
  • 频率:32.768 kHz;CL = 12.5 pF;常温频差 ±20 ppm;ESR 90 kΩ;封装 SMD1610-2P;工作温度 -40℃ ~ +85℃。

使用时请结合具体 MCU/RTC 数据手册中的晶体建议电路与回路参数进行验证,确保振荡器启动条件与频率稳定性满足系统要求。若需更详细的封装尺寸、回流曲线或可靠性试验数据,可联系供应商获取产品规格书(Datasheet)。

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