WMSIC Electronic Components

EPSON(爱普生) Q22FA12800018

ModelQ22FA12800018
PackageSMD2016-4P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON Q22FA12800018
Type
EPSON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
Q22FA12800018
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.028g
Frequency
32MHz
Electronic Component
1
Electronic Component
BM0265825714
Operating Temperature
20℃~+75℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±10ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EPSON Q22FA12800018无源贴片晶振产品概述

Q22FA12800018是爱普生(EPSON)推出的一款高性能无源贴片晶振,专为小型化、高稳定性时钟需求设计,采用SMD2016-4P封装,核心频率32MHz,兼顾精度与可靠性,适配多类电子设备的时钟源场景。

一、产品定位与核心属性

该晶振属于无源型贴片晶振,无内置振荡电路,需配合外部振荡电路(如MCU内部OSC模块、外部振荡管等)实现稳定振荡。作为爱普生针对中低端到工业级市场的主流产品,其核心定位是:在紧凑尺寸下提供可信赖的时钟信号,满足消费电子、工业控制、通信接口等场景的基本精度与温区需求,同时降低系统BOM成本(无源晶振成本低于有源晶振)。

二、核心性能参数详解

  1. 频率与精度:核心频率32MHz是电子设备中常见的接口时钟(如USB2.0、UART、SPI等)基准频率;常温频差±10ppm意味着32MHz下最大频率偏差为±320Hz,可避免因频率飘移导致的数据传输错误或时序紊乱;频率稳定度±10ppm(覆盖工作温度范围),即温度从-20℃到+75℃变化时,频率漂移不超过±320Hz,满足一般工业温区的稳定性要求。
  2. 负载电容与ESR:负载电容12pF是匹配振荡电路的关键参数,需确保外部电路(如MCU的OSC引脚外接电容)总负载电容与12pF匹配(通常为2个6pF电容并联),否则会影响振荡频率精度;等效串联电阻(ESR)60Ω属于无源晶振的合理范围,ESR越低振荡越稳定,60Ω可保证在多数电路中实现可靠起振。
  3. 工作温区:-20℃+75℃覆盖常温环境(040℃)及一般工业环境,可满足室内设备、户外小型传感器节点等场景的温度适应性。

三、封装与应用适配

采用SMD2016-4P封装,尺寸为2.0mm×1.6mm×0.8mm(典型值),4引脚贴片设计适配自动化SMT生产,适合PCB布局紧凑的小型设备(如可穿戴设备、微型控制器模块)。无源型设计无需额外供电,仅需外部匹配电容即可工作,简化电路设计的同时,避免了有源晶振的供电纹波干扰风险。

四、品牌与可靠性背书

爱普生作为全球知名晶振厂商,其产品以一致性好、可靠性高著称。Q22FA12800018经过严格生产测试,确保每颗晶振参数符合规格要求;无源晶振无内置电路的设计使其寿命更长(理论上无机械磨损,寿命可达数年),抗冲击、抗振动性能优于部分有源晶振,适合对可靠性有基本要求的工业与消费电子场景。

五、典型应用场景

  1. 工业控制模块:PLC输入输出模块、小型传感器节点(如温度/湿度传感器)的MCU时钟源,温区覆盖满足工业现场需求;
  2. 消费电子设备:智能手环、蓝牙耳机、小型智能家居设备的主时钟,紧凑尺寸适配设备小型化趋势;
  3. 通信接口电路:USB2.0集线器、UART转串口模块、SPI总线控制器的时钟基准,32MHz频率匹配多数接口协议;
  4. 汽车电子辅助设备:车载小型控制器(如胎压监测模块、车载USB接口)的时钟源,-20~75℃温区覆盖车载环境(非极端低温场景);
  5. 医疗小型设备:便携式监护仪、血糖监测仪的低功耗时钟,无源设计降低设备功耗。

该晶振以平衡的精度、尺寸与成本,成为多类电子设备时钟源的实用选择,适合对时钟精度要求不苛刻但需稳定可靠的场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.