WMSIC Electronic Components

X1E000021012900

ModelX1E000021012900
Package3225
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
EPSON X1E000021012900
Type
EPSON
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1E000021012900
Electronic Component
1
Package
3225
Electronic Component
Passive Crystal Oscillator
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0059607766
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:X1E000021012900 MHz Range Crystal Unit

一、产品简介

X1E000021012900 是一款由 EPSON(爱普生)公司生产的 MHz 范围晶体振荡器,采用 3225 封装。该元器件专为高频率应用设计,具有优良的频率稳定性和高精度,使其适用于各种通信设备、电子计量仪器及消费电子产品等领域。

二、主要参数

  • 频率范围:该晶体振荡器能在 MHz 范围内工作,具体频率可根据客户需求定制,通常在 10MHz 到 100MHz 之间。
  • 封装类型:3225 封装,尺寸为 3.2mm x 2.5mm,适合于空间受限的小型电路板设计。
  • 温度范围:一般支持 -40°C 到 +85°C 的工作温度,适用于多种环境条件下的应用。
  • 负载电容:可根据具体应用场景选择合适的负载电容,通常在 10pF 到 20pF 之间。
  • 品质因数(Q 值):高品质因数可确保晶体振荡器在特定频率点上具有优越的选择性和频率稳定性。

三、产品优势

  1. 高稳定性:X1E000021012900 在工作时能够保持极高的频率稳定性,特别适合对时间和频率要求严格的应用,例如通信产品和时钟同步系统。
  2. 低功耗:该产品采用先进的制造工艺,具有低功耗特性,有助于延长电池供电设备的使用寿命。
  3. 小型化设计:3225 封装的设计,使得该晶体振荡器可轻松地集成入自动化控制、电源管理及网络设备等各种小型电子产品中。
  4. 广泛的应用:可以广泛应用于无线通信设备、智能家居、工业控制、医疗设备、消费类电子产品以及车载电子系统等领域。

四、应用场景

X1E000021012900 适用于多种电子应用场景,具体包括但不限于:

  • 无线通信:在手机、平板、无线对讲机及基站等设备中提供高精度的时钟信号,是数据传输和处理的重要组件。
  • 消费电子:在智能手表、便携式音频设备、智能家居设备等产品中,作为主要的频率参考源,提高其性能和用户体验。
  • 工业控制:在各类传感器、自动化仪器、PLC 控制系统等中,提供稳定的时钟信号,确保工业设备的可靠运行。
  • 医疗设备:对时钟和数据传输要求高精度的医疗仪器,如 ECG、监护仪等,确保实时数据的精确处理。

五、总结

作为 EPSON 旗下的一款高性能 MHz 范围晶体振荡器,X1E000021012900 以其卓越的性能和广泛的适应性,满足了现代电子设备对高稳定性和精准度的需求。在当前日新月异的技术环境下,该产品将继续为众多应用提供可靠的频率支持,助力科技的不断进步和创新。无论是通信、消费电子还是工业控制领域,X1E000021012900 都是追求高性能系统设计的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.