WMSIC Electronic Components

ESPRESSIF ESP32-S3-MINI-1-N8 ESP32

ModelESP32-S3-MINI-1-N8
PackageSMD-41P
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-S3-MINI-1-N8
Type
ESPRESSIF
Minimum package
650 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-S3-MINI-1-N8
Electronic Component
1
Package
SMD-41P
Electronic Component
Other Module
Electronic Component
1.65g
Frequency
2.4GHz
Electronic Component
1
Power
20.5dBm
Current
330mA
Electronic Component
BM0226525635
Antenna
PCBAntenna
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Interface Type
SPI;I2S;USB;I2C;UART

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-S3-MINI-1-N8 产品概述

一、主要特性

ESP32-S3-MINI-1-N8 是基于乐鑫(ESPRESSIF)ESP32-S3FN8 核心芯片的多协议 SMD 模块,集成 8 MB SPI Flash 和板载 PCB 天线,工作于 2.4GHz 频段,支持 Bluetooth 5.0。模块面向体积受限且需快速量产的物联网与智能终端产品,兼顾性能、射频能力与封装化制造便利性。

二、硬件规格

  • 核心芯片:ESP32-S3FN8
  • 存储:8 MB SPI Flash
  • 射频频率:2.4GHz
  • 发射功率:20.5 dBm(典型)
  • 接收灵敏度:-98.2 dBm(典型)
  • 天线形式:板载 PCB 天线
  • 封装:SMD-41P,适合 SMT 工艺

三、电气与功耗

  • 工作电压:3.0 V ~ 3.6 V(建议使用稳定 3.3V 供电)
  • 发送电流(峰值):约 355 mA(发射时)
  • 接收电流:约 97 mA(接收时)
    在电源设计上应注意稳压能力和旁路去耦,建议在模块电源输入附近放置低 ESR 电容(例如 10µF 和 0.1µF 并联),并为射频瞬态电流考虑足够的电源裕量。

四、接口与外设

模块提供多种外设接口,包括 SPI、I2S、USB、I2C 和 UART,方便连接传感器、音频外设、存储器和上位机。I2S 与 USB 的存在使其适合低功耗音频、语音交互及数据传输应用。

五、天线与布局建议

模块采用板载 PCB 天线,使用时须保证天线周边有足够的空白区(通常建议 8–15 mm 的无金属区域,具体按模块资料核准),避免金属或大面积铜箔覆盖天线方向。地平面控制与接地连通需按照模组参考设计执行,以保持良好射频性能。若需外接天线,请确认模块版本与天线接口支持情况。

六、典型应用场景

  • 蓝牙低能耗外设与连接器件(BLE 传感器、遥控器)
  • 智能家居与可穿戴设备(低功耗无线通信)
  • 语音/音频输入设备与简单边缘计算(利用 I2S、USB)
  • 工业与商业物联网节点,需在严酷温度范围(-40℃~+85℃)工作的场合

七、封装与生产注意事项

SMD-41P 封装便于 SMT 贴装与批量生产。建议在 PCB 布局阶段参考官方模块资料和建议封装尺寸,按照回流焊规范选择焊盘与阻焊,避免对板载天线区域进行覆铜。量产前进行射频和电磁兼容性(RF/EMC)测试,确认整机性能与认证需求。

总结:ESP32-S3-MINI-1-N8 模块以 ESP32-S3 强大的处理与外设能力、较高的发射功率与灵敏度、以及标准化 SMD 封装,为各类需要 2.4GHz Bluetooth 连接的嵌入式和 IoT 产品提供了成熟可靠的解决方案。在设计时重视电源完整性与天线留空,将有助于实现稳定的无线性能与良好量产良率。

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