WMSIC Electronic Components

ESPRESSIF ESP32-S3-WROOM-1-N8R2 ESP32

ModelESP32-S3-WROOM-1-N8R2
PackageSMD,18x25.5mm
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-S3-WROOM-1-N8R2
Type
ESPRESSIF
Minimum package
650 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-S3-WROOM-1-N8R2
Electronic Component
1
Package
SMD,18x25.5mm
Electronic Component
Other Module
Electronic Component
2.5g
Frequency
2.4GHz
Electronic Component
1
Power
20.5dBm
Current
355mA
Electronic Component
BM0226525630
Antenna
PCBAntenna
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Interface Type
SPI;I2S;USB;I2C;UART

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-S3-WROOM-1-N8R2 产品概述

一、概述

ESP32-S3-WROOM-1-N8R2 是乐鑫(Espressif)推出的一款多协议 SMD 无线模块,内置 ESP32‑S3R2 核心芯片,集成 2 MB PSRAM(die)与 8 MB SPI Flash,模块尺寸 18 × 25.5 mm。模块工作在 2.4 GHz 频段,支持 Wi‑Fi 与 Bluetooth 5.0(BLE)协议,板载 PCB 天线,适合需要高性能计算、语音、图像及多外设接口的嵌入式产品。

二、关键性能参数

  • 核心芯片:ESP32‑S3R2(支持向量指令集加速的 AI/ML 推理能力)
  • 存储:2 MB PSRAM(die),8 MB SPI Flash
  • 频率:2.4 GHz(Wi‑Fi/Bluetooth)
  • 发射功率:20.5 dBm(典型)
  • 接收灵敏度:-98.2 dBm
  • 工作电压:3.0 V ~ 3.6 V
  • 发送电流:355 mA(最大,发射时)
  • 接收电流:97 mA(接收/活跃)
  • 接口:SPI、I2S、USB、I2C、UART(丰富的外设支持)
  • 天线形式:板载 PCB 天线
  • 封装:SMD,尺寸 18 × 25.5 mm

三、应用场景

模块适用于智能家居控制、可穿戴设备、工业无线传感器、语音交互终端、边缘 AI、智能音箱、无线数据采集等需要稳定无线连接与较高处理能力的场景。集成的 PSRAM 与 Flash 为图像缓冲、音频处理与机器学习模型提供了良好存储支持。

四、设计与布局建议

  • 电源:使用低噪声 LDO 或 DC‑DC,确保供电能力满足高峰发射电流(典型 355 mA),在输入端增加 10 µF 与 0.1 µF 并联旁路电容,靠近模块电源引脚放置。
  • RF 区域:为 PCB 天线预留规定的空地(keep‑out)区域,避免金属或大面积地铜靠近天线,模块方向应与设备外壳和其它天线保持足够间距以降低互扰。
  • 地与接地:模块底部有接地垫,器件周围推荐多层接地平面以降低 EMI,保持信号回流路径短且连续。
  • 接口布局:USB、UART 等高速接口布线要短且差分对成对布局,I2S/PCM 与音频器件靠近以减少噪声耦合。
  • ESD 与散热:在外部 I/O 加入适当的保护元件(TVS),发射高功率时注意热管理与周围元件热容。

五、选型与合规

ESP32‑S3‑WROOM‑1‑N8R2 为通过工业级温度范围设计(-40 ℃ ~ +85 ℃),适合商用到工业级应用。模块由 Espressif 官方设计并提供软件支持与 SDK,使固件开发与 OTA 升级更方便。实际产品上线前建议进行天线调试(S11/匹配)、功率与接收灵敏度验证以及整机认证(CE、FCC、SRRC 等)测试。

简洁、尺寸小、功能丰富且具备较高射频性能与算力,使该模块成为需要无线连接与边缘智能处理的优选解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.