WMSIC Electronic Components

ESPRESSIF ESP32-C3 ESP32

ModelESP32-C3
PackageQFN-32-EP(5x5)
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-C3
Type
ESPRESSIF
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-C3
Electronic Component
1
Package
QFN-32-EP(5x5)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.175g
CPU
Other
I / O
22
Electronic Component
1
ADC
12bit
Electronic Component
BM0264576592
Operating Voltage
3V~3.6V
CPU
160MHz
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-C3 产品概述

ESP32-C3是乐鑫(ESPRESSIF)推出的一款集成无线通信的RF片上系统(SoC),以小体积、低功耗、双模无线及丰富外设为核心优势,广泛适配各类物联网终端场景。以下从核心性能、无线能力、硬件资源、封装供电及应用等维度展开概述:

一、核心架构与运算性能

ESP32-C3采用单核心MCU架构(基础参数标注为“其他”类CPU内核),最大主频可达160MHz,具备高效的运算处理能力。该架构在保持基础计算性能的同时,优化了功耗控制,可在低负载场景下自动进入低功耗模式(如深度睡眠模式),延长设备续航时间,适合对功耗敏感的物联网应用(如电池供电的穿戴设备)。

二、双模无线通信能力

作为RF SoC,ESP32-C3集成了2.4GHz Wi-Fi + BLE 5.0双模无线模块,覆盖主流物联网通信需求:

  • Wi-Fi功能:支持IEEE 802.11b/g/n协议,传输速率最高可达150Mbps,可实现稳定的网络连接与数据传输,适配家庭、办公等Wi-Fi环境;
  • BLE 5.0功能:具备低功耗、长距离(支持远距离模式,传输距离较BLE4.2提升2-4倍)、多设备连接(支持同时连接多个BLE从设备)等特性,适合近距离低功耗通信场景;
  • 双模可同时工作或按需切换,平衡性能与功耗,满足不同场景下的通信需求(如同时上报传感器数据至云端及连接手机蓝牙)。

三、硬件接口与外设资源

ESP32-C3提供丰富的硬件接口与外设,适配各类外设接入与控制需求:

  • I/O引脚:共支持22个可配置I/O引脚,可灵活定义为数字输入输出、PWM(最多支持6通道)、UART(2通道)、SPI(2通道)、I2C(1通道)等接口,满足传感器、显示屏、按键等外设的连接;
  • ADC模块:内置12位分辨率ADC,支持最多10通道模拟信号采集,可实现环境温湿度、电池电量、传感器模拟输出等高精度检测;
  • 基础外设:集成3个通用定时器、2个看门狗定时器、RTC时钟、温度传感器等模块,提升系统运行的稳定性与可靠性。

四、封装与供电特性

  • 封装规格:采用QFN-32-EP(5×5mm)封装,体积小巧,引脚间距0.5mm,适合对空间要求严格的小型化设备(如穿戴设备、智能家居节点);
  • 供电范围:工作电压为3V~3.6V,兼容常见的锂电池(如3.7V锂电池经稳压后)或外部直流电源,供电稳定性高,降低了电源电路的设计复杂度;支持低功耗模式下的快速唤醒,进一步提升续航。

五、典型应用场景

ESP32-C3凭借其特性,广泛应用于以下物联网场景:

  1. 智能家居:智能灯控、温湿度传感器节点、门窗传感器、智能插座等;
  2. 可穿戴设备:智能手环、运动监测器、健康监测设备(如心率传感器节点);
  3. 工业物联网:远程设备状态监测、环境监测终端、小型工业控制器(如电机控制);
  4. 消费电子:智能玩具、蓝牙音箱、小型蓝牙遥控器、无线耳机配件;
  5. 智慧城市:街道环境监测点、智能垃圾桶节点、共享单车锁控模块。

六、开发支持

乐鑫提供完善的开发生态:支持ESP-IDF(乐鑫官方开发框架)、Arduino框架等多种开发方式,提供丰富的示例代码、技术文档及社区支持;同时支持OTA(空中下载)升级功能,方便设备后期维护与功能迭代,降低了开发者的入门门槛,加速产品原型验证与量产落地。

整体而言,ESP32-C3以高集成度、小体积、低功耗为核心优势,是物联网终端设备的高性价比选择,适用于多数中低复杂度的无线通信场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.