WMSIC Electronic Components

ESPRESSIF ESP32-WROVER-IE-N8R8 ESP32

ModelESP32-WROVER-IE-N8R8
PackageSMD,18x31.4mm
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-WROVER-IE-N8R8
Type
ESPRESSIF
Minimum package
650 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-WROVER-IE-N8R8
Electronic Component
1
Package
SMD,18x31.4mm
Electronic Component
Other Module
Electronic Component
3.2g
Frequency
2.4GHz
Electronic Component
1
Power
20.5dBm
Electronic Component
BM0264880402
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Interface Type
I2C;GPIO;UART;SPI;SDIO;I2S
Electronic Component
Bluetooth4.2
IC
ESP32-D0WD-V3

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-WROVER-IE-N8R8 产品概述

一、核心芯片与硬件配置

ESP32-WROVER-IE-N8R8采用乐鑫自研的ESP32-D0WD-V3作为核心处理芯片,具备高性能低功耗的架构优势。硬件存储方面,集成8MB SPI flash(用于固件烧录、用户数据持久化存储)和64Mbit PSRAM(即8MB外部随机访问内存)——PSRAM可有效扩展运行内存,满足多任务并行处理、大数据量缓存(如音视频流、传感器连续数据)的需求。此外,模块内置IPEX射频连接器,支持外接天线,大幅提升信号稳定性与覆盖范围。

二、支持协议与接口资源

模块聚焦蓝牙无线通信与多外设扩展,协议及接口覆盖主流嵌入式场景:

  • 无线协议:支持Bluetooth 4.2,可实现设备配对、数据传输、低功耗连接(BLE模式);
  • 常用接口:
    • I2C:适合连接小型传感器(温湿度、加速度计)、外设,通信简单且占用引脚少;
    • GPIO:支持数字输入输出、中断触发,可扩展按键、LED、继电器等基础外设;
    • UART:标准TTL串口,兼容GPS模块、串口摄像头等常见串口设备;
    • SPI:高速串行接口,支持多设备级联,适合连接SPI flash、OLED显示屏等高速外设;
    • SDIO:可扩展SD卡存储,或对接支持SDIO协议的WiFi扩展模块;
    • I2S:音频串行接口,支持音频输入输出,适配语音识别、蓝牙音箱等音频场景。

三、射频性能参数

模块工作在2.4GHz ISM频段(蓝牙主流频段),射频性能突出:

  • 发射功率20.5dBm:属于中高功率级别,室内可覆盖多房间(无遮挡下约30-50米),室外空旷区域可达百米级范围,能有效解决信号遮挡问题;
  • 接收灵敏度-97dBm:弱信号接收能力强,在复杂电磁环境(如工业厂房、密集建筑群)下仍能保持稳定通信,抗干扰能力优于普通蓝牙模块。

四、电源与工作环境

  • 电源要求:工作电压范围3V~3.6V,常用3.3V供电(与大部分嵌入式系统电压匹配),无需额外电平转换,简化电路设计;
  • 工作环境:温度范围-40℃~+85℃,属于工业级宽温设计,可适应户外严寒、高温场景(如智能农业监测、工业设备无线通信),以及室内外温差较大的环境。

五、封装与典型应用场景

模块采用SMD贴片封装,尺寸为18mm×31.4mm,适合PCB表面贴装,便于集成到紧凑型设备中。典型应用场景包括:

  1. 工业物联网:工业传感器节点、设备远程监控(宽温适应 harsh环境);
  2. 智能家居:智能网关、智能家电控制(蓝牙连接+多接口扩展);
  3. 智能穿戴:智能手环、手表的无线通信模块(低功耗+小封装);
  4. 音频设备:蓝牙音箱、语音助手(I2S接口支持音频处理);
  5. 无线传感器网络:环境监测节点(多I2C接口连温湿度、光照等传感器)。

该模块平衡了性能、稳定性与成本,是嵌入式无线通信、物联网应用的高性价比选择,尤其适合对宽温、多外设扩展有需求的场景。

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