WMSIC Electronic Components

ESPRESSIF ESP32-C3-MINI-1-H4 ESP32

ModelESP32-C3-MINI-1-H4
PackageSMD,13.2x16.6mm
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-C3-MINI-1-H4
Type
SMD, 13.2X16.6MM
Minimum package
650 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-C3-MINI-1-H4
Electronic Component
1
Package
SMD,13.2x16.6mm
Electronic Component
Other Module
Electronic Component
1.4g
Frequency
2.4GHz
Electronic Component
1
Power
20.5dBm
Electronic Component
BM0226525504
Antenna
PCBAntenna
Operating Temperature
40℃~+105℃
Operating Voltage
3.3V
Interface Type
SPI
Receiver
96dBm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-C3-MINI-1-H4 产品概述

一、简介

ESP32-C3-MINI-1-H4 是乐鑫(ESPRESSIF)推出的低尺寸、高集成度 2.4GHz 无线收发器模块,支持 Wi‑Fi 802.11b/g/n 与蓝牙 v5.0。模块集成 PCB 印制天线,工作频段覆盖 2.412GHz ~ 2.484GHz,适合需要短距无线连接的物联网设备及消费/工业类终端产品。

二、主要参数

  • 品牌:ESPRESSIF(乐鑫)
  • 工作频段:2.412GHz ~ 2.484GHz
  • 无线协议:Wi‑Fi 802.11b/g/n;蓝牙 v5.0
  • 发射功率:20.5 dBm(典型)
  • 接收灵敏度:-96 dBm(典型)
  • 接口类型:SPI(用于与主控通信)
  • 工作电压:3.3 V
  • 工作温度:-40 ℃ ~ +105 ℃
  • 天线形式:板载 PCB 天线(印制线)
  • 封装:SMD,尺寸 13.2 × 16.6 mm

三、性能与优势

  • 高发射功率与较好接收灵敏度,使得理论链路预算接近 116.5 dB(20.5 dBm − (−96 dBm)),在无遮挡或室内环境中有利于提高通信稳定性与覆盖。
  • 板载 PCB 天线省去外部天线设计,便于产品小型化与快速开发;SMD 封装适合自动贴片与批量生产。
  • 宽温工作范围(-40 ℃ 到 +105 ℃)满足多数工业与室内消费场景的环境需求。
  • SPI 接口可作为主控与无线模块之间的高速命令/数据通道,便于将模块作为外置无线收发单元集成到多种系统中。

四、典型应用场景

  • 智能家居与安防(传感器、开关、门锁等)
  • 工业物联与远程监控终端
  • 无线网关与边缘节点(短距离设备接入)
  • 便携式设备与消费类电子(对体积和功耗有中等要求的场合)

五、集成与设计注意事项

  • 电源:保证稳定 3.3 V 供电并在靠近模块电源引脚处布置适当去耦电容,减小电源噪声对 RF 性能的影响。
  • 天线区与地平面:为保证辐射性能,应遵循模块厂商的天线留空和地平面建议,避免在天线前方和侧面放置大面积金属或 PCB 铜箔。
  • 接地与屏蔽:可靠的地平面和合理的过孔布局有助于抑制噪声并保证射频一致性。
  • 布线:SPI 信号线尽量短且有良好阻抗控制,避免与高频电源或大电流回路平行布线。
  • 认证与测试:虽然模块集成天线并在设计上便于合规,但整机仍需在目标市场进行射频与 EMC 测试与认证(如 FCC、CE 等)。

六、采购与封装

模块为 SMD 可回流焊贴装,尺寸 13.2 × 16.6 mm,适合自动化贴装和大批量生产。选型时建议向乐鑫或授权分销商索取最新的技术文档、参考设计和天线布局建议,以确保产品开发周期和合规性。

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