WMSIC Electronic Components

ESPRESSIF ESP32-PICO-MINI-02-N8R2 ESP32

ModelESP32-PICO-MINI-02-N8R2
PackageSMD-53P,16.6x13.2mm
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-PICO-MINI-02-N8R2
Type
SMD-53P, 16.6X13.2MM
Minimum package
650 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-PICO-MINI-02-N8R2
Electronic Component
1
Package
SMD-53P,16.6x13.2mm
Electronic Component
Other Module
Electronic Component
1.56g
Frequency
2.4GHz
Electronic Component
1
Power
19.5dBm
Current
368mA
Electronic Component
BM0264757354
Antenna
PCBAntenna
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Interface Type
I2C;SPI;UART;I2S

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-PICO-MINI-02-N8R2 产品概述

一、核心芯片与性能基础

该模块搭载乐鑫ESP32 ECO V3芯片(ESP32系列升级版本),采用双核Tensilica LX6处理器架构,主频可达240MHz,运算能力充足,可同时处理多任务(如无线通信、数据采集、本地算法运算),满足物联网设备的复杂应用需求。芯片在稳定性、兼容性上进一步优化,支持长期稳定运行。

二、集成式存储配置

模块内置8MB flash和2MB PSRAM(均为die级集成,非外接芯片),无需额外扩展存储即可支撑多种场景:

  • 8MB flash:可存储固件(支持OTA远程升级)、本地配置数据及少量日志,避免因存储不足导致的固件更新失败;
  • 2MB PSRAM:作为高速缓存,能有效提升芯片运行效率(如处理音频流、复杂多线程任务时),减少卡顿现象。

三、无线性能与功耗

3.1 无线核心参数

  • 协议支持:Bluetooth 4.2(BLE)+ WiFi 802.11b/g/n(多协议特性,用户实际应用中可灵活切换);
  • 工作频率:2.4GHz ISM频段,全球通用,无需额外频段授权;
  • 天线设计:板载PCB天线,无需外接天线即可实现稳定通信,节省设备空间;
  • 发射功率:19.5dBm(高功率设计),空旷环境下覆盖范围可达100米以上,比常规BLE模块提升2-3倍;
  • 接收灵敏度:-97dBm,弱信号场景(如障碍物多、距离远)仍能保持稳定连接,抗干扰能力强。

3.2 功耗控制

  • 工作电压:3V~3.6V,适配锂电池(3.7V)、3.3V电源等常见供电方式;
  • 典型电流:接收模式111mA,发送模式368mA;支持深度睡眠模式(电流降至μA级),适合电池供电的便携式设备(如可穿戴、户外传感器)。

四、丰富接口与应用灵活性

模块提供多种常用外设接口,适配各类传感器、执行器及音频设备:

  • 数字接口:I2C(多设备通信,如温湿度传感器)、SPI(高速外设连接,如显示屏)、UART(串口通信,如PLC设备);
  • 音频接口:I2S(支持音频输入输出,如麦克风、扬声器);
    接口可灵活组合,满足智能家居、工业监测、消费电子等多场景需求。

五、封装与环境适应性

  • 封装形式:SMD(贴片封装),适合自动化贴片生产,体积紧凑(PICO系列定位“超小尺寸”),便于集成到小型设备(如智能门锁、可穿戴)中;
  • 工作温度:-40℃~+85℃,宽温范围可适应户外(农业大棚、智能路灯)、工业(车间传感器)等恶劣环境,抗温湿度变化能力强。

六、典型应用场景

  1. 智能家居:智能门锁(BLE通信+本地存储)、温湿度传感器节点(I2C连接传感器)、智能灯控(WiFi/BLE双连接);
  2. 工业物联网:车间环境监测(温湿度/气压传感器+UART上传数据)、设备状态采集(SPI连接显示屏);
  3. 消费电子:蓝牙音频设备(I2S连接麦克风/扬声器)、可穿戴手环(低功耗模式+BLE通信);
  4. 户外监测:农业大棚监测(宽温设计+BLE上传数据)、智能垃圾桶(传感器+OTA升级)。

该模块以“小体积、强性能、高集成”为核心优势,乐鑫完善的SDK文档与技术支持进一步降低了开发门槛,适合对尺寸、存储、无线覆盖有要求的物联网设备开发。

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