WMSIC Electronic Components

ESPRESSIF ESP32-D0WDQ6-V3 ESP32

ModelESP32-D0WDQ6-V3
PackageQFN-48-EP(6x6)
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-D0WDQ6-V3
Type
ESPRESSIF
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-D0WDQ6-V3
Electronic Component
1
Package
QFN-48-EP(6x6)
Type
Transceiver
Electronic Component
Wireless Transceiver IC
Electronic Component
0.535g
Electronic Component
98dBm
Electronic Component
1
Current
240mA
Electronic Component
BM0264880392
Operating Temperature
40℃~+125℃
Operating Voltage
2.3V~3.6V
Electronic Component
ISM; Wi Fi; Bluetooth
Interface Type
ADC;PWM;I2S;I2C;UART;SDIO;SPI

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-D0WDQ6-V3 产品概述

一、核心定位与品牌背景

ESP32-D0WDQ6-V3是乐鑫科技(ESPRESSIF)推出的低功耗WiFi+BLE双模系统级芯片(SoC),定位于工业级物联网(IoT)、ISM(工业科学医疗)及无线通信场景,整合射频收发器与微控制器功能,兼顾高性能与可靠性,是针对中高端IoT设备的核心解决方案。乐鑫作为全球IoT芯片领域的主流厂商,其ESP32系列以开源生态、高性价比著称,该型号进一步强化了工业级环境适应性。

二、关键性能参数总览

该芯片的核心参数直接支撑多场景适配能力:

  • 无线频段:覆盖2.412GHz~2.484GHz(2.4GHz ISM主流频段),兼容IEEE 802.11b/g/n(WiFi)与蓝牙低功耗(BLE)协议;
  • 无线性能:发射功率达20.5dBm(室内覆盖半径超100m,户外远距传输优势明显),接收灵敏度-98dBm(抗环境干扰能力强,弱信号场景下稳定通信),数据速率支持150Mbps(1x1 MIMO下802.11n速率,满足高速数据传输需求);
  • 功耗与供电:工作电压范围2.3V~3.6V(兼容纽扣电池、锂电池及线性稳压供电),发射电流240mA(高功率模式)、接收电流95mA(低功耗模式),平衡性能与续航;
  • 环境适应性:工作温度-40℃~+125℃(工业级宽温范围,适配户外、 harsh环境应用)。

三、丰富接口资源与扩展性

ESP32-D0WDQ6-V3内置多类外设接口,满足IoT设备的多样化扩展需求:

  • 模拟接口:ADC(模拟数字转换),支持多路模拟信号采集(如温湿度、电压、电流监测);
  • 数字接口:PWM(脉冲宽度调制,用于电机控制、LED亮度调节)、I2S(音频串行接口,适配麦克风、扬声器等音频外设)、I2C(两线串行,用于传感器、OLED等低速外设通信)、UART(通用异步收发,支持串口调试与设备对接)、SDIO(安全数字输入输出,外接存储或高速外设)、SPI(串行外设接口,高速短距通信,适配SPI屏、Flash等);
  • 接口兼容性强,可直接对接主流传感器、执行器及存储模块,降低系统设计复杂度,缩短开发周期。

四、典型应用场景

基于性能与接口优势,该芯片适用于以下场景:

  1. 工业物联网(IIoT):远程监测终端(如工业温湿度、压力传感器节点)、智能工厂设备联网(宽温适配车间 harsh环境);
  2. 智能家居:智能灯、门锁、温湿度控制器(BLE低功耗本地控制+WiFi远程联网,双无线满足多样化交互);
  3. 可穿戴与便携设备:智能手环、运动监测仪(低功耗BLE通信,单电池续航超1个月);
  4. ISM领域:医疗监测设备(如便携式血氧仪、监护仪)、工业仪器无线数据传输(符合ISM频段规范,无需额外授权)。

五、封装与可靠性设计

  • 封装形式:QFN-48-EP(6mm×6mm,48引脚,带暴露焊盘),体积紧凑,适合小尺寸设备(如穿戴、小型传感器);暴露焊盘增强散热性能,提升长期工作稳定性;
  • 可靠性:宽温范围、低功耗设计及成熟的射频性能,经过乐鑫工业级测试(如高低温循环、湿热老化),适配7×24小时连续工作场景,降低设备故障率。

总结

ESP32-D0WDQ6-V3通过整合WiFi+BLE双模、丰富接口、工业级宽温及高性价比,成为IoT与ISM领域的主流SoC选择,兼顾消费级应用的灵活性与工业级应用的可靠性,满足从家庭到工业的多样化需求。

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