Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ESPRESSIF ESP-WROOM-02D-N4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ESPRESSIF ESP-WROOM-02D-N4
- Type
- ESPRESSIF
- Minimum package
- 650 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ESPRESSIF
- Electronic Component
- ESP-WROOM-02D-N4
- Electronic Component
- 1
- Package
- SMD,18x20mm
- Electronic Component
- Other Module
- Electronic Component
- 1.904g
- Frequency
- 2.4GHz
- Electronic Component
- 1
- Power
- 20.5dBm
- Current
- 170mA
- Electronic Component
- BM0264880389
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.7V~3.6V
- Interface Type
- I2C；SPI；UART；I2S
- Receiver Current
- 50mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ESP-WROOM-02D-N4 WiFi模块产品概述
乐鑫科技推出的ESP-WROOM-02D-N4是一款高集成度工业级WiFi连接模块，核心搭载自研ESP8266EX SoC，针对物联网设备的低成本、小体积需求优化设计，支持802.11协议，内置PCB天线与32Mbits SPI Flash，可快速实现设备的WiFi联网功能，广泛适配各类物联网场景。
一、核心芯片与定位
ESP-WROOM-02D-N4以乐鑫ESP8266EX为核心，该芯片是一款集成WiFi射频+基带+MCU的系统级芯片（SoC），无需外接额外MCU即可独立运行用户程序，大幅降低系统BOM成本。模块定位为「低成本工业级WiFi解决方案」，兼顾性能与成本，适合对体积、稳定性要求较高的物联网设备。
二、基础参数核心要点
类别 关键参数说明 WiFi协议 支持802.11b/g/n，发射功率20dBm（覆盖范围广） 存储资源 内置32Mbits（4MB）SPI Flash（存储固件+少量数据） 工作范围 电压2.7V3.6V，温度-40℃+85℃（工业级） 封装尺寸 SMD贴片，18mm×20mm（体积紧凑）三、接口资源与扩展能力
模块提供4类核心接口，支持灵活扩展外设：
- UART：主通信接口，可与单片机（STM32/51）、传感器快速对接，实现数据收发；
- I2C/SPI：串行接口，适配温湿度传感器、OLED屏、存储芯片等外设；
- I2S：音频接口，可连接麦克风、扬声器，支持简单音频采集/播放；
- PCB天线：内置天线，无需外接，节省空间且保证信号稳定性。
四、电源与功耗特性
功耗表现适配多数物联网场景：
- 接收电流：典型值56mA（WiFi接收状态）；
- 发送电流：典型值170mA（WiFi发送状态）；
- 供电兼容性：2.7V~3.6V宽电压，支持锂电池（3.7V）、线性稳压电源，适合电池供电设备。
五、典型应用场景
凭借工业级温度范围、小体积与多接口，该模块广泛用于：
- 智能家居：智能灯、插座、温湿度监测节点；
- 工业物联网：远程设备状态监测、工厂环境监测；
- 消费电子：智能玩具、穿戴设备（数据同步）、小型家电；
- 智能农业：温室环境监测、灌溉系统远程控制。
六、优势总结
ESP-WROOM-02D-N4的核心竞争力：
- 高集成度：内置Flash+天线，减少外接元件，降低系统复杂度；
- 成本可控：ESP8266系列成熟方案，性价比突出；
- 环境适应性：-40℃~+85℃工业级温度，适配 harsh场景；
- 扩展灵活：多接口支持，快速适配不同外设需求。
该模块是物联网设备实现WiFi联网的「高性价比选择」，适合批量生产与小型化设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
