WMSIC Electronic Components

ESPRESSIF ESP32-S2-MINI-2-N4 ESP32

ModelESP32-S2-MINI-2-N4
PackageSMD
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-S2-MINI-2-N4
Type
ESPRESSIF
Minimum package
650 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-S2-MINI-2-N4
Electronic Component
1
Package
SMD
Electronic Component
Other Module
Electronic Component
2.14g
Frequency
2.4GHz
Electronic Component
1
Power
19.5dBm
Current
310mA
Electronic Component
BM0265116679
Antenna
PCBAntenna
Operating Temperature
40℃~+105℃
Operating Voltage
3V~3.6V
Interface Type
SPI;I2S;USB;I2C;UART

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-S2-MINI-2-N4产品概述

一、核心芯片与基础规格

ESP32-S2-MINI-2-N4由乐鑫科技(ESPRESSIF)设计,核心采用ESP32-S2FH4 ECO1芯片,并集成4MB板载Flash Die——无需额外外接存储器件,直接满足固件存储与数据缓存需求,有效简化硬件设计流程。模块采用SMD(表面贴装)封装,体积紧凑,适配各类小型化终端产品的批量生产,是针对物联网场景优化的高集成度WiFi模块。

二、通信接口与连接能力

模块支持丰富外设接口,覆盖多场景下的设备互联与功能扩展:

  • SPI接口:支持高速外设通信(如OLED显示屏、SPI存储芯片),速率适配灵活;
  • I2S接口:专为音频数据传输设计,可连接麦克风、扬声器等组件,满足基础音频交互需求;
  • USB接口:支持设备枚举与数据传输,便于固件烧录、调试及USB外设(如键盘、U盘)连接;
  • I2C/UART接口:兼容主流传感器(温湿度、运动传感器)、控制器(蓝牙模块、继电器),实现多节点数据采集与控制;
  • WiFi通信:符合802.11协议,工作在2.4GHz频段,兼容主流家庭/工业WiFi网络环境。

三、射频性能参数

射频性能直接决定模块的通信稳定性与覆盖范围:

  • 发射功率:19.5dBm,室内环境可穿透2-3道墙体,室外开阔场景覆盖半径可达数十米;
  • 接收灵敏度:-96.5dBm,在弱信号或电磁干扰环境下仍能保持稳定连接,抗干扰能力较强;
  • 天线形式:板载PCB天线,一体化设计无需额外外接天线,既节省空间又降低BOM成本,同时保证基础通信覆盖需求。

四、电源与工作环境

模块适配多种电源场景,工作环境适应性强:

  • 工作电压:3V~3.6V,兼容常见锂电池(3.7V)、3.3V线性电源,无需复杂电源转换电路;
  • 电流消耗:接收模式下仅77mA(低功耗设计),发送模式下302mA,适合电池供电的便携式设备;
  • 工作温度:-40℃~+85℃,达到工业级温度范围,可稳定工作在严寒、高温等恶劣环境(如户外传感器、工业控制节点)。

五、集成特性与优势

相比传统WiFi模块,ESP32-S2-MINI-2-N4的核心优势在于高集成度与小型化:

  1. 集成Flash Die,减少外部器件数量,降低硬件故障率;
  2. 板载PCB天线,无需额外天线组件,缩小模块体积(SMD封装适配贴装工艺);
  3. 乐鑫提供开源SDK与开发工具,固件开发资源丰富,上手门槛低。

六、典型应用场景

模块的参数特性使其适配多种物联网终端:

  • 智能家居:智能开关、温湿度传感器、智能门锁(宽温、低功耗、WiFi连接);
  • 工业物联网:户外数据采集节点、设备状态监测(-40℃~+85℃工业级温度);
  • 音频设备:小型智能音箱、语音交互终端(I2S接口支持音频处理);
  • 便携式设备:智能手环、手持数据终端(电池供电适配3V~3.6V,低接收电流);
  • 消费电子:WiFi玩具、小型智能遥控器(体积紧凑,易集成)。

该模块以高性价比、高集成度的特点,成为物联网场景下WiFi通信的主流选择之一。

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