WMSIC Electronic Components

ESPRESSIF ESP32-WROOM-32E-H4 ESP32

ModelESP32-WROOM-32E-H4
PackageSMD,18x25.5mm
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-WROOM-32E-H4
Type
ESPRESSIF
Minimum package
650 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-WROOM-32E-H4
Electronic Component
1
Package
SMD,18x25.5mm
Electronic Component
Other Module
Electronic Component
2.15g
Frequency
2.4GHz
Electronic Component
1
Power
20dBm
Current
239mA
Electronic Component
BM0226578457
Antenna
PCBAntenna
Operating Temperature
40℃~+105℃
Operating Voltage
3V~3.6V
Interface Type
I2C;GPIO;UART;SPI;SDIO

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-WROOM-32E-H4 产品概述

一、概述

ESP32-WROOM-32E-H4 是基于乐鑫(ESPRESSIF)ESP32-D0WD-V3(ECO V3)核心的多协议 SMD 模块,面向对无线连接、边缘计算及传感器网关等场景的嵌入式产品。模块集成 4 MB SPI Flash 与板载 PCB 天线,规格小巧、适合自动贴装。

二、核心参数

  • 工作温度:-40℃ ~ +105℃
  • 核心芯片:ESP32-D0WD-V3(ESP32 ECO V3)
  • 存储:4 MB SPI flash
  • 频率:2.4 GHz
  • 发射功率(Max):20 dBm
  • 接收灵敏度:-98 dBm
  • 工作电压:3.0 V ~ 3.6 V(典型 3.3 V)
  • 发送电流:239 mA(典型)
  • 接收电流:112 mA(典型)
  • 支持协议:Bluetooth 4.2
  • 天线形式:板载 PCB 天线
  • 封装:SMD,尺寸 18 × 25.5 mm

三、关键特性

  • 高性能 MCU 无线子系统,适合需要低时延与中等吞吐的应用。
  • 板载 PCB 天线,易于快速集成与量产,节省外置天线设计工作量。
  • 宽温设计(-40℃ 至 +105℃),满足工业级要求。
  • 丰富的外设接口(I2C、GPIO、UART、SPI、SDIO),便于连接各类传感器与存储设备。

四、电气与功耗考量

  • 模块工作电压范围 3.0–3.6 V,推荐 3.3 V 稳压电源;电源须具备足够瞬态放电能力以应对最高 239 mA 的发射峰值电流。
  • 建议在电源输入端并联低 ESR 电容(例如 10 μF 与 0.1 μF)以抑制瞬态降压。
  • I/O 电压与模块工作电压一致,若主控或外设为 5 V 电平,应加入电平转换保护。

五、接口说明(摘要)

  • UART:串口通信、调试及固件下载
  • SPI:外设高速扩展与存储器接口
  • I2C:传感器与低速外设总线
  • SDIO:可用于高速外部 SD 卡或外设
  • 通用 GPIO:支持 PWM、ADC(需查芯片完整资料)等功能

六、天线与封装注意

  • 板载 PCB 天线对周围金属与地平面高度敏感,布局时应在天线区域保留天线附近的 15–20 mm 空白区(具体参考厂商 PCB 布局指南)。
  • 模块为 SMD 封装,适合 SMT 回流工艺;贴装与焊接时请参照厂商推荐的焊盘与回流曲线。

七、典型应用

  • 智能家居与穿戴终端(蓝牙连接)
  • 工业传感器网关、远程监控节点(宽温需求)
  • 低功耗便携设备与原型验证平台

八、设计与可靠性建议

  • 在产品开发阶段,优先参考乐鑫官方数据手册与评估板参考设计;进行天线调试与射频链路测试以达成最佳覆盖与灵敏度。
  • 对于电源管理与 EMC,建议做整机级的功耗与传导/辐射测试,保证在目标环境下的稳定性与合规性。

如需原理图、封装库、参考焊盘或完整电气特性,请参考 ESPRESSIF 官方资料或联系模块供应商获取技术支持。

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