Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EXAR SP485CN-L/TR SP485CN
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- EXAR SP485CN-L / TR
- Type
- EXAR
- Minimum package
- 2500
Technical parameters
- Electronic Component
- EXAR
- Electronic Component
- SP485CN-L/TR
- Electronic Component
- 1
- Package
- SOIC-8
- Type
- Transceiver
- Electronic Component
- RS-485 / RS-422IC
- Electronic Component
- 0.24g
- Electronic Component
- 32
- Electronic Component
- 1
- Features
- Tx / Rx
- Electronic Component
- BM0230663416
- Operating Temperature
- 0℃~+70℃
- Operating Voltage
- 4.75V~5.25V
- Receiver
- 1
- Data
- 5Mbps
- Communication
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EXAR SP485CN-L/TR 产品概述
一、概述
EXAR（艾科嘉）SP485CN-L/TR 是一款用于差分串行总线的收发器（transceiver），集成1路驱动器和1路接收器，采用标准SOIC-8 封装并以卷带（TR）形式供货。器件工作电压范围为4.75V～5.25V，支持高达5 Mbps 的数据传输速率，通讯模式为半双工，适用于需要可靠双向差分通信的嵌入式与工业控制系统。
二、主要电气与环境参数
- 电源电压：4.75 V ～ 5.25 V（典型5 V 系统兼容）
- 数据速率：最高 5 Mbps，适合高速RS-485/RS-422类总线应用
- 工作温度：0 ℃ ～ +70 ℃（商业级温度范围）
- 静态电流：典型 900 μA（低功耗静态特性）
- 通讯模式：半双工（驱动器与接收器共用差分线对）
- 封装：SOIC-8（利于手工焊接与自动贴片生产）
三、功能与优势
- 高速传输能力，可满足快速数据采集与实时控制需求；
- 低静态电流，在待机或空闲时降低系统整体功耗；
- 标准SOIC-8 封装，便于替换与布局、支持卷带出货便于SMT生产；
- 半双工架构简单，适合点对点或多节点总线结构；
- 商业温度等级适配多数室内与受控环境工业场景。
四、典型应用场景
- 工业自动化现场总线、PLC 与I/O 模块间通信；
- 楼宇控制与安防系统（门禁、监控回传）；
- 仪器仪表数据采集与集中器通信；
- 串行通讯扩展卡、RS-485 转换模块与网关设备。
五、设计与使用注意事项
- 终端匹配：长线或多节点总线建议在两端使用120 Ω 差分终端电阻以避免反射；
- 偏置与防漂移：若总线上无固定主机，需通过偏置电阻（例如680 Ω/560 Ω）实现故障安全（failsafe）状态，保证空闲线输出为定义电平；
- 电源去耦：VCC 近旁放置0.1 μF 陶瓷去耦电容，以抑制瞬态和EMI；
- 布线：差分对走线长度匹配、分布一致并保持阻抗控制，避免锐角与不必要的过孔；
- ESD 与短路保护：在严苛环境下可选用浪涌抑制元件或共模电感增强抗扰度；
- 驱动控制：半双工模式下正确控制DE/RE 引脚的使能时序，避免总线冲突。
六、封装与采购信息
SP485CN-L/TR 的 SOIC-8 封装便于通用电路板布局，封装后缀 TR 表示以卷带方式供货，适合批量自动化贴片生产。建议在设计阶段确认板级布局与焊盘尺寸以保证良好的焊接和热性能。
总结：SP485CN-L/TR 以其5 Mbps 的高速能力、低静态功耗与标准SOIC-8 封装，适合对成本、功耗与传输速率有平衡要求的工业与楼宇控制类差分串行通信应用。在实际应用中，合理的总线终端、偏置与电源布局将显著提升系统的可靠性与抗干扰性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
