Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EXAR SP232EET-L/TR SP232EET
Configuration
1 options
Configuration
21+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- EXAR SP232EET-L / TR
- Type
- EXAR
- Unit
- Electronic Component
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- EXAR
- Electronic Component
- SP232EET-L/TR
- Electronic Component
- 1
- Package
- SOIC-16-300mil
- Type
- Transceiver
- Electronic Component
- RS232IC
- Electronic Component
- 0.694g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0000283258
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.5V~5.5V
- Receiver
- 2
- Data
- 240Kbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SP232EET-L/TR 产品概述
SP232EET-L/TR 是一款高集成度的RS-232收发器，专为满足工业和消费电子应用中的串行通信需求而设计。作为一款功能强大的双向通信设备，SP232EET-L/TR提供了两个驱动器和两个接收器，能够实现完全双工的数据传输，确保数据的快速和可靠传输。
基本参数与特点
SP232EET-L/TR的工作电源电压范围为4.5V至5.5V，使其适用于多种电源环境，同时保持低功耗运行。这款收发器的最大数据传输速率可达240kbps，适用于需要高速度通信的应用场景，如工业自动化系统、安防监控、数据采集和智能仪器等。其接收器的滞后电压为500mV，有效地抑制了噪声干扰并确保数据传输的准确性。
SP232EET-L/TR的工作温度范围广泛，从-40°C到85°C，适合在恶劣环境中使用。这使得该产品在不同行业中的广泛应用成为可能，特别是在高温或低温的环境中，如汽车电子、气象监测、环境监测等。
封装与安装
SP232EET-L/TR采用16-SOIC封装，尺寸为0.295英寸（7.50mm宽），是一种表面贴装型的封装形式。这种设计方便了自动化生产和PCB设计中的集成，节省了空间，提高了设备的整体可靠性。此外，SOIC封装在热管理和电磁兼容性方面表现良好，适合那些对外形和性能都有严格要求的应用。
应用场景
得益于其兼容RS-232协议，SP232EET-L/TR广泛应用于多个领域，包括但不限于：
工业自动化：在PLC（可编程逻辑控制器）、HMI（人机界面）和SCADA（监控与数据采集系统）中，经常需要高速和可靠的数据传输。
消费电子：在各类消费电子产品中，如打印机、计算机和通讯设备，SP232EET-L/TR可用于串行通信，确保设备之间的顺畅连接。
汽车电子：车辆中的各种传感器和控制单元往往需要通过串行接口进行信息传递，而SP232EET-L/TR的耐高温特性使其适用于汽车内部环境。
医疗设备：在需要数据采集和传输的医疗设备中，此收发器能够提供稳定的通信保证，尤其在便携式设备和病床监护仪中具有重要作用。
环境监测：该产品可用于各种环境监测设备中，需要在不同的物理条件下保持稳定的通信性能。
总结
SP232EET-L/TR 是一款性能优越的RS-232收发器，凭借其高数据传输速率、广泛的工作温度范围和可靠的电源管理，成为工业、消费电子、汽车电子和医疗等多个领域的重要元器件。无论是设计新设备还是升级现有系统，SP232EET-L/TR都能为用户提供可靠而高效的解决方案，进一步推动串行通信技术的发展。对于需要高可靠性与稳定性的应用，SP232EET-L/TR 无疑是一个值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
