WMSIC Electronic Components

ETA ETA5050V18S2F

ModelETA5050V18S2F
PackageSOT-23-5
BrandETA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ETA ETA5050V18S2F
Type
ETA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ETA
Electronic Component
50uVrms
Electronic Component
ETA5050V18S2F
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.049g
Electronic Component
1
Features
Output
Electronic Component
BM0238681850
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
1.8V
Output Current
500mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ETA5050V18S2F 产品概述

ETA5050V18S2F 是钰泰(ETA)推出的一款高性能、低功耗固定输出线性稳压器,输出电压为 1.8V,最大输出电流 500mA,采用 SOT-23-5 封装。器件针对便携式和低噪声电源应用进行了优化,特点是高电源纹波抑制、低静态电流和完整的保护功能,适合为 MCU 内核、电源域和射频前端等敏感模块供电。

一、主要特性

  • 固定输出:1.8V,正向输出,单通道设计。
  • 工作电压:输入最高 6V(器件额定工作区),适配常见电池与总线电压。
  • 输出电流:最大 500mA,满足中等功率负载需求。
  • 低静态电流:典型 Iq = 37µA,适合电池供电与待机功耗受限场景。
  • 低噪声:输出噪声 50µVrms,有利于敏感模拟与 ADC 应用。
  • 高 PSRR:70dB(典型),在低频至中频范围内有效抑制输入纹波与噪声。
  • 保护功能:过流保护(OCP)、使能控制(EN)、热关断(TSD),提高系统可靠性。
  • 工作温度范围:-40℃ 至 +125℃(结温 Tj),适应工业级环境。
  • 封装:SOT-23-5,体积小,便于空间受限的 PCB 布局。

二、电气与性能要点解读

高达 70dB 的 PSRR 能在典型开关电源附近显著降低纹波耦合到 1.8V 轨;配合 50µVrms 低输出噪声,本器件适合为 ADC 前端、参考电路或射频混频器供电。37µA 的静态电流在待机时将系统漏电降至较低水平,有利于延长电池寿命。内建过流与热关断提供了对异常工况的自动保护,提高系统安全性。

三、典型应用场景

  • 便携式与可穿戴设备的数字核供电(MCU/核心域)
  • 低噪声模拟前端与传感器电源(ADC、放大器)
  • 物联网节点、电池供电模块
  • 射频前端或混合信号系统中需要净化电源的子系统

四、布局与外围建议

  • 输入/输出端靠近芯片放置去耦电容,优先使用低 ESR 的陶瓷电容(典型 1µF~10µF),确保稳态与瞬态响应;具体电容值请参考器件数据手册的稳定性要求。
  • EN 管脚需要明确上拉或下拉以避免不确定态,建议通过 MCU 或上游电源控制。
  • SOT-23-5 封装对散热依赖 PCB 铜箔,建议在 VOUT/GND 区域增加散热铜铜层并铺铜连通多层地,以提升热耗散能力。
  • 保持电源走线短且粗,减少寄生感抗与压降,尤其是在大电流瞬态场景下。

五、热管理与可靠性注意

在靠近最大输出电流和输入电压较大时,器件功耗上升(Pd = (Vin - Vout) × Iout),需要通过 PCB 散热与热限流策略控制结温。热关断是保护手段但非长期解决方案,建议在系统设计中预留热裕量并评估最差工况下的结温。

六、包装与选型提示

SOT-23-5 小封装便于空间优化,但受限于散热能力;若系统常在高载或高输入压差下工作,应在系统级进行热仿真或考虑更大散热能力的方案。选型时结合实际输入电压范围、最大瞬态电流与器件数据手册中的典型与极限参数评估。

总结:ETA5050V18S2F 以其低噪声、高 PSRR、低静态电流和完善的保护功能,适合对电源质量与功耗敏感的嵌入式与模拟应用。合理的 PCB 布局与热设计能够充分发挥其性能,确保长期可靠运行。若需更详细的典型应用电路与参数曲线,请参考钰泰官方数据手册。

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