Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ETA ETA3414S2F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ETA ETA3414S2F
- Type
- ETA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ETA
- Electronic Component
- ETA3414S2F
- Electronic Component
- 1
- Package
- SOT23-5
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.052g
- Electronic Component
- 1
- Features
- EMI Optimization
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0227335617
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 2.6V~7V
- Switching Frequency
- 3MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ETA3414S2F 产品概述
一、简介
ETA3414S2F 是钰泰（ETA）推出的一款高频降压型同步整流开关稳压器，采用降压拓扑并内置功率开关，专为空间受限且要求高效率、快速瞬态响应的便携与消费电子设备设计。器件工作电压范围宽，从2.6V至7V，输出电流可达1.5A，开关频率高达3MHz，支持可调输出，工作结温范围为-40℃至+125℃，封装为紧凑的SOT23-5。
二、主要特点
- 输入电压范围：2.6V ~ 7V，适合单节锂电池及多电池供电系统。
- 输出能力：最大输出电流1.5A，内置开关管，简化外部元件布局。
- 高频工作：典型开关频率3MHz，有利于缩小电感与电容尺寸，降低系统体积。
- 同步整流：集成同步整流，提高转换效率，特别在中低压差工况下效率优势明显。
- 可调输出：通过外部电阻分压调整输出电压，适配多种供电需求。
- 宽温度与可靠性：工作温度范围-40℃~+125℃，适应工业级应用环境。
- 封装：SOT23-5，小型化便于手工焊接与SMT生产。
三、典型应用
- 手机、蓝牙耳机等便携终端的电源管理。
- 电池供电的手持设备、可穿戴设备。
- 摄像头模块、显示驱动偏压电源。
- 工业控制或仪表中需高效率、低纹波的降压点供电。
四、主要电气参数与性能要点
- 拓扑结构：降压（Buck），同步整流。
- 最大输出电流：1.5A（需配合合适散热与布局）。
- 开关频率：3MHz（典型），利于小型电感与陶瓷输出电容。
- 可调输出电压：通过外部分压电阻设置，支持低压输出到更高电压。
- 保护功能：内置过流保护、过温保护与软启动（具体门限请参考数据手册）。
- 建议外围：低ESR陶瓷输入/输出电容、封装匹配的功率电感（频率、峰值电流匹配）。
五、设计建议与注意事项
- 高频工作使得布局尤为重要：输入电容应靠近VIN和GND引脚，开关节点走线短而宽，减少环路面积以抑制噪声与发热。
- 输出电感选型需考虑峰值电流与直流电阻，以兼顾效率与温升。
- 当输出电流接近1.5A时，注意器件结温及PCB铜箔面积，必要时增加散热铜箔或热 vias。
- 为保证稳定性与低纹波，输出电容宜选用X7R或更好特性的陶瓷电容，并留意实际容量随直流偏置下降的影响。
- 参考钰泰提供的典型应用电路与布局示意，调试时先从低负载逐步增大进行验证。
六、封装与订购信息
- 封装形式：SOT23-5，适合空间受限应用与中小批量生产。
- 品牌型号：ETA3414S2F（钰泰）。
- 订购或样片测试时建议索取最新数据手册以获取完整电气参数、典型应用和推荐布局图。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
