Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ETA ETA3000D2I
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ETA ETA3000D2I
- Type
- ETA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ETA
- Electronic Component
- ETA3000D2I
- Electronic Component
- 1
- Package
- DFN2x2-8
- Electronic Component
- Battery Management
- Electronic Component
- 0.048g
- Electronic Component
- 1
- Features
- Programmable Current
- Electronic Component
- BM0226444662
- Current
- 2A
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3.75V~12V
- Battery Type
- Battery
- Battery
- 2
- ICType
- IC
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ETA3000D2I产品概述
一、产品简介
ETA3000D2I是钰泰（ETA）面向两节电池组（2S）设计的均衡芯片，工作电压范围3.75V～12V，支持最大充电电流2A、均衡电流2A。芯片静态电流仅2µA，工作温度覆盖-40℃至+85℃，采用DFN2x2-8小封装，适合对体积、能效和均衡能力有较高要求的便携类电源方案。
二、主要特性
- 支持2节电池（2S）系统工作与均衡；
- 最大充电电流：2A，均衡电流：2A，能在充电阶段实现高效电池平衡；
- 工作电压宽：3.75V～12V，适配常见2S锂电组；
- 极低静态电流：Iq = 2µA，有利于待机能耗控制；
- 环境温度范围广：-40℃～+85℃，可靠性高；
- 小尺寸封装：DFN2x2-8，便于空间受限设计。
三、典型应用场景
- 移动电源与充电宝（2S方案）；
- 便携式电动工具、手持设备；
- 小型UPS、备用电源模块；
- 物联网和工业便携测量设备。
四、设计与使用注意事项
- ETA3000D2I为均衡芯片，建议与标准CC/CV外置充电管理或恒流电源配合使用，确保充电限流与终止策略由上层充电器完成；
- 芯片不支持电池温度检测，关键场合需外接NTC或独立温度管理电路以保证安全；
- 均衡及充电电流达2A，PCB走铜与铜箔面积需满足散热与电流承载要求，均衡电阻或功率器件应选型匹配；
- DFN2x2-8焊盘建议带热沉焊盘，做好散热与可靠焊接；芯片附近配置去耦电容，避免高频抖动。
五、封装与可靠性建议
DFN2x2-8小封装利于高密度布局，但散热条件受限。建议在PCB底层开铜、增加过孔并靠近电流回路布线，保证在2A连续工作时热量能够被有效扩散，提升寿命与稳定性。
六、选型建议
若系统为2节锂电且需在充电过程中实现快速均衡、同时对待机能耗有严格要求，ETA3000D2I是体积小、性能均衡的合适选择。设计时务必结合实际充电策略与热管理方案，并参考ETA官方完整资料进行阈值和保护参数验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
